Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Seika Recognizes Top Performing McDry Reps during APEX
February 22, 2017 | Seika MachineryEstimated reading time: 1 minute
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to announce its top McDry representatives for 2016. The top three reps were recognized during the recent IPC APEX EXPO in San Diego. The top McDry reps in order of sales performance in 2016 are:
- Armand Karolian, Assembly Tech LLC
- Tommy O’Conner, Hisco, Inc.
- Ernesto Bader, Ceiba Technologies, Inc.
“Seika Machinery appreciates the enthusiastic support of our sales representatives and distributors for the McDry cabinets,” said Michelle Ogihara, Seika Machinery’s Senior Sales Manager. “Our customers and sales network have confidence in the quality and performance of McDry for their critical dry storage applications. This year at APEX we featured the N2 Auto-Purge and popular Feeder storage models.”
McDry dry boxes, dry cabinets and desiccators provide optimal ultra-low humidity and moisture-proof storage for IC packages. Moisture-sensitive components – when safely and properly stored in McDry – have an indefinite floor-life and micro-cracking or pop-corning during the reflow process is not an issue.
Other storage applications for McDry include original prints, printed wiring boards (PWBs), polymide film, tape reels, feeders and various electronic components and materials. McDry cabinets conform to IPC/JEDEC J-STD 033C and IPC 1601 Guidelines.
For more information about Seika’s complete product line, contact Michelle Ogihara at michelle@seikausa.com or visit www.seikausa.com.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.