-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Lenovo Develops Innovative Low Temperature Solder Process
February 23, 2017 | LenovoEstimated reading time: 3 minutes
Lenovo has announced a new patent-pending Low Temperature Solder (LTS) process developed to improve PC manufacturing by conserving energy and increasing reliability.
Ever since having to abandon the use of lead-based solder more than 10 years ago due to environmental concerns, the electronics industry has been searching for a solution to reduce heat, power consumption and carbon emissions by improving the tin-based solder process which replaced the older lead-based process. The newer tin-based process required extremely high temperatures consuming more energy and adding significant stress on components.
With a new LTS process, Lenovo proves it continues to be at the forefront of innovation, introducing a game-changing manufacturing process that is not only applicable to Lenovo products, but can be universally applied to all electronics manufacturing involving printed circuit boards with no cost or performance impact to customers.
The true innovation is in the science and testing required to develop and validate the new LTS process. Lenovo investigated thousands of combinations of solder paste material composed of a mixture of tin, copper, bismuth nickel and silver, specific compositions of flux material and unique profiles of time and heat temperatures that combine to enable this process. As is typical in standard electronics assembly using surface mount technology (SMT), the solder and flux mixture is first printed on the face of the circuit board. The components are then added and heat is applied to melt the solder mixture, securing and connecting the components to the board. With the new LTS process, soldering heat is applied at maximum temperatures of 180°C, a reduction of 70°C from the previous method. Throughout testing and validation, Lenovo used existing materials to compose the solder paste and existing oven equipment for heating, thus Lenovo can implement the new system without increasing production costs.
After validation of the procedure, Lenovo discovered a significant reduction in carbon emissions as a result of using the new process. The procedure is already in production for ThinkPad E series and the 5th generation X1 Carbon recently announced at CES. Throughout 2017, Lenovo intends to implement the new LTS process on eight SMT lines and estimates savings of up to 35% on carbon emissions. By the end of 2018, Lenovo aims to have 33 SMT lines with two ovens per line using this new process, giving an estimated annual saving of 5,956 metric tons of CO2. To put this into perspective, the equivalent reduction in CO2 emissions is equal to the consumption of 670,170 gallons of gasoline per year.
Through the new process, Lenovo also expects better reliability for its devices due to lower heat stress during the "oven bake" procedure. In the early stages of deployment, Lenovo has observed a 50% decrease in printed circuit board warpage and a reduction in defective parts per million during the manufacturing process.
"By implementing the new LTS process, Lenovo is continuing to show its commitment to upholding sustainable business practices across its PC business," said Luis Hernandez, vice president, Lenovo PC and Smart Devices Integrated Development Center. "Our focus on innovation extends beyond R&D and product design, to the way our products are manufactured. We are dedicated to advancing our business goals while reducing our impact on the environment and we’re proud this process achieves that."
Lenovo continues to prove itself as a leader in innovation, technology and sustainability. Its commitment to supporting a transition to a lower carbon economy is further demonstrated by the savings the new LTS process brings. Furthermore, in 2018 Lenovo intends to offer the new procedure for use on an industry-wide basis free of charge.
About Lenovo
Lenovo is a $45 billion global Fortune 500 company and a leader in providing innovative consumer, commercial, and enterprise technology. Our portfolio of high-quality, secure products and services covers PCs (including the legendary Think and multimode Yoga brands), workstations, servers, storage, smart TVs and a family of mobile products like smartphones (including the Moto brand), tablets and apps.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.