RTW IPC APEX EXPO: Tara Dunn talks with Clark Webster from All Flex

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

MacDermid Alpha Showcases Advanced Soldering Materials for High-Reliability Electronics Assembly at NEPCON Thailand 2026

06/11/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions will present its latest materials technologies at NEPCON Thailand 2026, held June 17 to 20 at the Bangkok International Trade & Exhibition Centre (BITEC), Thailand. Recognized as a premier gathering for technology leaders and manufacturers, the event supports one of the world’s most dynamic electronics manufacturing regions.

PCB Technologies to Exhibit at IMS 2026 in Boston

06/05/2026 | PCB Technologies Ltd.
Issey Ende, VP of Sales and Marketing for PCB Technologies, has announced that the company will be exhibiting at IMS 2026, (IEEE International MTT Symposia) the world’s leading event for the RF, microwave, and high-frequency electronics industry, taking place June 7th through June 13th, 2026, at the Thomas M Menina Convention and Exhibition Center in Boston, Massachusetts.

MacDermid Alpha Introduces ALPHA® OM-377 Solder Paste for Reliable Ultra-Fine Feature Printing at Production Scale

06/04/2026 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistry solutions for the electronics industry, announced the launch of ALPHA® OM-377, a no-clean solder paste engineered for ultra-fine feature printing in advanced electronics assemblies.

Learning with Leo: The Cost of Cleaning and Protecting the Ozone Layer

06/03/2026 | Leo Lambert -- Column: Learning With Leo
I share this perspective based on my experience as a member of the United Nations Environment Programme (UNEP) Solvent, Coatings and Adhesives Technical Options Committee, which developed the report “Protecting the Ozone Layer” to inform policy decisions at the 1995 Meeting of the Parties to the Montreal Protocol in Nairobi. My involvement in this work dates back to 1976, when I joined Digital Equipment as an engineer supporting manufacturing operations, focusing on soldering and cleaning processes across global facilities.

Happy’s Tech Talk #48: Digital Twins—Integrating Design and Manufacturing

06/02/2026 | Happy Holden -- Column: Happy’s Tech Talk
New product realization and design for manufacturing and assembly (DFM/A) are becoming increasingly visible as programs that can improve time-to-market and reduce product costs. These simulations of real-time manufacturing are now referred to as digital twins. While many companies are developing such programs, a unifying framework is needed to coordinate their application.