Global Sourcing Spotlight: How Global Sourcing Drives Innovation
One World, One Industry: IPC APEX EXPO 2025 Marks a Special Anniversary Year
Nolan’s Notes: Your Golden Ticket
Indium to Feature Indium8.9HF Solder Paste at SMT Hybrid Packaging 2017
March 8, 2017 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste to help customers Avoid the Void® at SMT Hybrid Packaging, which will be held on May 16-18, 2017, in Nuremberg, Germany.
Indium8.9HF is a no-clean, halogen-free solder paste that delivers versatility and stability in the printing process. Under optimal process conditions, Indium8.9HF:
- Demonstrates consistent printing performance for up to 12 months when refrigerated
- Maintains excellent printing and reflow performance after remaining at room temperature for one month
- Delivers excellent response-to-pause even after being left on the stencil for 60 hours
About Indium Corporation
Indium Corporation, the industry-leading source of void-reducing materials and performance, has specifically formulated Indium8.9HF solder paste to reduce voiding significantly below the industry average for improved finished goods reliability. Indium8.9HF delivers robust reflow capabilities and a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes defects.
Indium8.9HF has a unique oxidation barrier technology that makes it perfectly suited for a variety of applications, especially automotive assembly.
For more information about Indium Corporation’s low-voiding solder pastes, visit www.indium.com/avoidthevoid or see Indium Corporation at booth 4-321.
Share on:
Suggested Items
AIM Solder Partners with Performance Technologies Group for Sales Representation in Northeast US
03/12/2025 | AIM SolderAIM Solder, a global leader in solder assembly materials for the electronics industry, is excited to announce its new partnership with Performance Technologies Group, Inc. (PTG), an established electronic manufacturers’ representative.
Indium Corporation, Industry Partners to Showcase Products 'Live@APEX'
03/10/2025 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from March 18-20 in Anaheim, California.
Indium Experts to Present on Solder and Thermal Solutions at APEX 2025
03/07/2025 | Indium CorporationAs a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related topics at IPC APEX Expo, March 18-20 in Anaheim, California.
Indium to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025
03/05/2025 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.
Black Diamond Orders Hentec Industries/RPS Automation Vector 300 with EMP Upgrade
03/03/2025 | Hentec Industries/RPS AutomationThe Vector 300 is the most compact model in the selective soldering Vector series lineup, making it ideal for facilities with limited space. Despite its size, the Vector 300 can process boards up to 300 x 300 mm (11.8 x 11.8 in.).