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March 16, 2017 | SMTAEstimated reading time: 1 minute
SMTA and SMART Group have finalized the program for the Contamination, Cleaning and Coating Conference. The event will be held May 22-24, 2017 at the Radisson Blu Airport Hotel in Amsterdam, Netherlands.
A half-day workshop on Cleaning Printed Circuit Assemblies, Design & Process Control will open the conference on Monday, May 22, 2017. Bob Willis will instruct the course along with Helmut Schweigart, Ph.D., ZESTRON, and Mike Bixenman, DBA, KYZEN Corporation.
This global conference is a strong two and a half day technical event focused on the most important and timely issues on contamination, cleaning and conformal coating in the manufacture of electronics. Conference sessions will include Residues Trapped Under Component Terminations, How Problematic are Contaminants Left on Printed Circuit Assemblies, Process Control and Cleaning Material Innovations and Conformal Coating Materials and Processes.
On Tuesday, May 23, Prabjit Singh, Ph.D., IBM Corporation, will provide his keynote presentation on the “Occurrence and Prevention of Electronic Hardware Failures due to Gaseous and Particulate Contamination in Data Centers.”
Rudiger Knofe, Siemens AG, will keynote Wednesday, May 24 with his presentation titled “Cleaning of Electronics: Analysing Cleaning Results and Potential Damage Risks When Cleaning Process is Not Optimal.”
The Contamination, Cleaning and Coating Conference is the first-ever conference co-organized by SMTA and SMART Group.
Registration is now open for the conference. For more information, click here.
About SMTA
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. A global association Working at a local level.
About SMART Group
The SMART Group Aims to Promote the Advancement of the Electronics Manufacturing Industry through the Education, Training and Notification of its Members in Surface Mount and Related Assembly Technologies, and by the Promotion of a Community of Electronics Manufacturing Professionals.
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