-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
New Smart Profilers – KIC SPS
March 17, 2017 | KICEstimated reading time: 2 minutes
KIC today announced plans to introduce its new thermal profiler. This new reflow profiler transforms thermal process data collection from a costly chore to a value-added function. The core function of a reflow oven is to produce an acceptable profile on each PCB. The new KIC SPS smart profiler collects the profile data and compares it to the process specifications. Within seconds, our new smart profiler also suggests an improved reflow oven setup.
One of the exciting new aspects of this release is KIC’s new ecosystem, where the profile data automatically gets uploaded to a central database model for storing, retrieval and sharing. This allows for factory-wide soldering optimization and management.
The new smart profiler features a slick compact design made with an LCP (Liquid Crystal Polymer) enclosure for better heat protection & faster cool-down between profiles. It utilizes a rechargeable battery, profile stacking, Wi-Fi and Bluetooth for wireless data communication plus much more. This all new smart thermal profiler design has been optimized for maximum thermal protection plus robust long-term operation.
KIC President Bjorn Dahle states, “There are very few machines in the factory exposed to the kind of harsh environment that a thermal profiler has to endure - going through thousands of heating and cooling cycles. Not only did we need to develop an easy-to-use accurate profiler, but we also wanted to make sure the profiler was robust enough to last for years to come.
That however, was the easy part. We also are turning data collection into additional value for companies. This is done by generating data for true insight into the thermal process and to enable immediate storing, sharing and analysis on each soldering machine as well as factory-wide, or worldwide.”
The new KIC SPS smart profiler enables technicians and engineers to run their reflow ovens, wave solder and selective soldering machines more efficiently for improved uptime & consistent quality.
For more information about us or our new smart profiler, please visit www.kicthermal.com.
About KIC
Based in San Diego, KIC is the industry leader in automated thermal process tools and systems for reflow, wave, curing and semiconductor thermal processes. The company pioneered the development of oven profilers and process optimization tools, and then worked to create the next generation of thermal systems to help manufacturers improve the thermal process quality while reducing cost.
KIC products include the KIC K2, X5, KICstart2, ProBot, 24/7 Wave and the KIC RPI. With the introduction of cutting edge tools, the company continues to stay on the leading edge of process optimization and automatic thermal process systems, and has won numerous industry awards.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.