Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
Indium Corporation’s Lim to Present at ICEP 2017
March 17, 2017 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at ICEP 2017 on April 19-22 in Tendo, Japan.
Lim’s presentation, Benchmarking Study for High-Temperature and High-Reliability Pb-Free Die-Attach Material Technologies and Expectations, will discuss the results of an industry-wide survey initiated by iNEMI. The survey was designed to benchmark the availability of high-temperature Pb-free die-attach materials, the technological feasibility for the same, and ongoing industrial trends. Lim will detail survey insights on industrial preferences and outline potential lead-free materials.
Lim has more than 20 years of experience in the PCB assembly and semiconductor packaging industries and is highly respected in her field. She earned her bachelor’s degree in chemistry from the National University of Singapore and has 17 years of experience in the SMT and PCB assembly industries. She is an SMTA-certified process engineer and has a Six Sigma Green Belt. Lim joined Indium Corporation in 2007.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com.
Share on:
Suggested Items
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
Global Citizenship: What I’ve Learned About the American PCB Business
11/20/2024 | Tom Yang -- Column: Global CitizenshipNavigating the complexities of the American PCB business has been an eye-opening experience. During my time in America, I have become more familiar with the American PCB business and doing business here. If I may, and with your indulgence, I would like to share my humble impressions of the American PCB industry and the American way of doing business, which I find interesting and admirable.
Spirit Announces Purchase Agreement with Tex Tech Industries for Intended Sale of FMI
11/19/2024 | Spirit AeroSystems, Inc.Spirit AeroSystems Holdings, Inc. announces a purchase agreement to sell Fiber Materials, Inc (FMI) business based in Biddeford, Maine, and Woonsocket, Rhode Island, to Tex-Tech Industries, Inc. for $165,000,000 in cash, subject to customary adjustment.
Ventec to Become Primary PCB Materials Supplier for Teltonika
11/13/2024 | VentecVentec International Group and high-tech design and manufacturing company Teltonika announce that Ventec is to become supply chain partner and primary supplier of PCB base materials to Teltonika, which is preparing to open a new PCB manufacturing plant at its base in Vilnius, Lithuania.
AIM to Present on Micro/MiniLED Applications at Hangjia Talk in Shenzhen, China
11/11/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming Hangjia annual industry event focused on the future of the LED display sector.