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SHENMAO America Intros Omega Aleaciones Exclusive Mexico Distributor of Solder Paste & Flux
March 20, 2017 | SHENMAO America, Inc.Estimated reading time: Less than a minute
Omega Aleaciones S.V. Sales and Application Engineering Team reinforces SHENMAO's commitment to providing EMS and OEM customers with the highest quality and technical solutions solder paste to meet the challenges of today's SMT assembly and product reliability throughout Mexico.
Three Omega Aleaciones Sales, Service and Application Engineering Staff successfully completed Product Application Training at SHENMAO Technology, Inc. Headquarter in Taiwan.
With 11 of the 12 largest EMS companies as its customers, SHENMAO Technology, Inc. of TaoYuan City 328, Taiwan, a global leader of Superior Solder Materials with 10 Manufacturing, Technical and Sales Support Facilities located around the world. SHENMAO America, Inc., the American subsidiary, manufactures Solder Paste in San Jose, CA, U.S.A., supporting a wide range of products for the PCBA and Semiconductor Industries, complimented from multiple locations in Mexico by Exclusive Distributor Omega Aleaciones S. A. de C. V. own Products of Wave Solder Bar, Cored Solder Wire, Flux and collection of Solder Dross.
As the World’s Major Solder Materials Provider for 44 years, SHENMAO produces SMT Solder Paste, Laser Soldering Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux, LED Die Bonding Solder Paste and PV Ribbon.
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Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
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Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.