Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

Londian Wason, NAIKAN to Build Copper Foil Plant in Kazakhstan

11/09/2026 | ACN Newswire
According to Official Information Source of the Prime minister of the Republic of Kazakhstan, on 5 November 2026, Londian Wason New Energy Tech Inc. and NAIKAN Ltd. held a cooperation agreement signing ceremony in Astana.

Ventec, MICAM to Establish European CCL Joint Venture in Ireland

11/09/2026 | Ventec
Ventec International Group, a Taiwanese specialist manufacturer of copper-clad laminates (CCL) and prepregs (PP) serving a global customer base, and MICAM a long-established manufacturer of advanced composites to the industrial, security and defence industries are developing a joint venture to establish copper-clad laminate production at MICAM’s manufacturing facility in Mallow, Ireland.

MacDermid Alpha to Showcase SiC Power Module Technology at electronica 2026

11/03/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions will exhibit at electronica 2026 (November 10–13, Messe München, Booth C2.654), showcasing its upcoming BondPad technology, an Argomax® film-laminated copper-foil solution for sintered die-topside attach in high-power, high-reliability silicon carbide (SiC) packages.

November SMT007 Magazine Explores the New Age of Sourcing

11/03/2026 | I-Connect007 Editorial Team
The November 2026 issue of SMT007 Magazine, “The New Age of Sourcing,” examines how EMS companies are gaining better visibility and control over purchasing, inventory, and supply chain costs. After years of disruption, sourcing teams are finding new ways to move beyond spreadsheets and put more complete, consistent information to work.

What AI Servers Are Asking of the PCB

10/29/2026 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.
AI infrastructure is pushing PCB performance into new territory. As data rates move from 56 Gbps to 112, 224, 337 Gbps and beyond, the challenge isn't simply building more boards to support growing computing demand. Those boards also have to carry faster signals with less loss, often across increasingly complex, high-layer-count constructions. That puts new pressure on one of the most fundamental parts of the PCB: its materials.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in