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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Applied Materials, UCLA Accelerate Semiconductor Innovation at EPIC Center

10/09/2026 | Globe Newswire
Applied Materials, Inc. announced that the UCLA Samueli School of Engineering will join the company’s EPIC Center in Silicon Valley as a research partner.

Microchip Technology Acquires VORAGO Technologies

10/09/2026 | Globe Newswire
Microchip Technology Incorporated, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions, announced that it has acquired VORAGO Technologies, Inc., a privately held provider of radiation-hardened and radiation-tolerant microcontrollers (MCUs) and microprocessors (MPUs), based in Austin, Texas.

Chiplytics Raises $4.5M to Strengthen US Electronics Supply Chain

10/08/2026 | BUSINESS WIRE
Chiplytics, a pioneer in microelectronics verification technology, announced a $4.5 million funding round led by Scout Ventures and Waypoint Ventures and the opening of an inspection laboratory in Bellport, New York.

Pasqal Leads Q-PLANET to Advance EU Neutral-Atom Quantum Technologies

10/06/2026 | Globe Newswire
Pasqal, a global leader in neutral-atom quantum computing, is coordinating the implementation of Q-PLANET (Quantum Pilot Line for production of Advanced chips for Neutral atom European Technologies), co-funded by the EU Chips Joint Undertaking (Chips JU) and National/Regional authorities.

Follow the Story: Building the Hardware Behind AI

09/24/2026 | Michelle Te, I-Connect007
When TTM opened its new UHDI facility in New York earlier this year, it wasn't simply adding another PCB factory. As the largest circuit board builder in the United States, TTM was investing in technologies that bring PCB fabrication closer to the complex world of semiconductor packaging. The advent of AI helps explain why that matters. The enormous compute power required by AI is pushing chip performance to new levels, but those chips don't operate in isolation.
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