-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Goepel's 3D·EyeZ Ensures Safe Mounting of Press-fit Connectors through Depth Measurement
March 22, 2017 | GOEPEL ElectronicEstimated reading time: 1 minute

Goepel electronic's 3D·EyeZ sensor system offers a wide range of applications in electronics manufacturing due to its shadow-free measurement. The unique design allows for the measurement of the press-in depth of press-fit connectors mounted on PCBs. It is possible to directly measure inside the drill-holes of the PCB and determine the position of the pin tip within the PCB material. Even in holes with a diameter of up to 200µm, the exact position inside the drill-hole can be measured with an accuracy of up to 5µm.
Figure 1: Pin tip inside the drill hole.
This level of quality control is required, for example, to ensure proper electrical functionality of this type of plug-in connector when used for high-frequency data transmission in telecommunications applications.
In addition to this application, 3D·EyeZ allows circumference and set depth inspection of conventional connector pins on PCBs. Possible test functions are control of the x/y deflection and measurement of the pin height.
Despite the increasing miniaturization and ever higher integration density on electronic assemblies, plug connectors are still an important part of assembled components. In addition to solder joints and polarity, correct assembly and mechanical properties of the individual pins are of critical importance for quality assessment.
The measurement module 3D·EyeZ, together with the orthogonal camera and the rotating angled-view module Chameleon, is optionally available for the AOI systems from Goepel electronic, both inline and standalone.
Image 2: Sensor Module 3D·EyeZ
Goepel electronic is a leading provider of innovative test and inspection solutions for printed circuit board assemblies (PCBAs) and electronic devices and systems. The company is divided into four divisions:
- Automotive Test Solutions
- Embedded JTAG Solutions
- Industrial Function Test
- Inspection Solutions AOI·AXI·SPI·IVS
For more information visit www.goepel.com.
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.