-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Rehm Presents New Innovations at SNEC and NEPCON
March 24, 2017 | Rehm Thermal SystemsEstimated reading time: 2 minutes

This April, Rehm Thermal Systems will appear at two major international trade fairs in Asia, which are both going to be held in Shanghai, China: SNEC, from April 19–21, and NEPCON China, from April 25–27.
SNEC
SNEC is one of the most renowned solar industry platforms in Asia. With over 1500 exhibitors from 90 countries, it is one of the world's largest trade fairs in the photovoltaics sector. This year, Rehm will be showcasing the VOC Thermal Oxidizer, designed for exceptionally efficient and sustainable solar cell manufacture.
Reduce VOCs by 99.9% with the Thermal Oxidizer
In the VOC Thermal Oxidizer, Rehm is offering one of the most effective residue management systems on the market. During the heating process, the volatile organic compounds (VOCs) released by the pastes are cracked and converted almost entirely into carbon dioxide and water. All available systems operate with a separation efficiency reaching up to 99.9%, ensuring compliance with German air pollution regulations. Oxidizer systems with heat recovery such as the available counter flow reactor (CFR) are also particularly energy-efficient and eco-friendly.
Visitors to Rehm's stand (Booth E3-001) can also find out more about new systems developments in the solar sector. The product portfolio ranges from efficient firing systems for standard mono- and multicrystalline metalization of solar cells to high-quality solar dryers. The flexible, modular structure allows for a variety of different production layouts, while reduced energy consumption and higher performance make the systems ideal for a wide variety of uses.
NEPCON China
NEPCON China is one of the biggest names in electronics industry trade fairs in Asia. Rehm Thermal Systems is one of over 500 leading companies who will be exhibiting innovations and the latest systems technology for modern and efficient electronics manufacture in Shanghai. Rehm will be at Booth 1E40.
VisionXP+ Vac: The 2-in-1 solution for convection reflow soldering
The VisionXP+ convection soldering system combines various advances in technology, particularly with regard to energy efficiency optimisation and emissions reduction. It allows customers to reduce energy use in electronics manufacture by up to 20% and consumes on average 10 tonnes less CO2 per year. For the first time ever, the vacuum option makes it possible for convection soldering to take place with or without a vacuum – in one system! The VisionXP+ Vac reliably removes gas cavities and voids during the soldering process, while the solder is still in its optimum molten state. With a vacuum pressure of up to 2 mbar, void rates of less than 2% can be achieved.
CondensoXC: Compact structure – huge performance
The CondensoXC, designed for reliable condensation soldering, has a compact structure thanks to its innovative processing chamber. And it performs in a big way. With its patented injection principle, the exact amount of Galden® required is added to the process for optimal profiling. The closed-loop filter system allows almost 100% of the medium to be regained and filtered. The system is completely suitable for vacuums and has an integrated process recorder for maximum traceability.
About Rehm Thermal System
As a specialist in the field of thermal system solutions for the electronics and photovoltaics industries, Rehm is a technology and innovation leader in the modern and economical production of electronic modules. As a globally operating manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for the metallization of solar cells as well as numerous customer-specific special systems, we are represented in all relevant growth markets and, as a partner with more than 25 years of industry experience, we implement innovative manufacturing solutions that set standards.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.