-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
MC Assembly Takes Inspection Capabilities to the Next Level
March 24, 2017 | MC AssemblyEstimated reading time: 3 minutes
MC Assembly, a leading mid-tier electronics manufacturing services provider, recently enhanced its inspection capabilities by purchasing and installing a Nordson YESTECH FX940 ULTRA 3D Automated Optical Inspection (AOI) machine. This new equipment upgrade allows 3D inspection of printed circuit board assemblies (PCBAs) for quality control during surface mount technology (SMT) operations.
This investment in SMT inline 3D AOI capability is the first step in incorporating 3D inspection capabilities as part of MC Assembly’s standard service offerings. Previously MC Assembly offered 3D AOI inspection off-line and as an optional service. This new change of incorporating the 3D AOI inline demonstrates MC Assembly’s continues commitment to optimizing quality control and inspection capabilities. MC Assembly plans to upgrade the inspection to 3D AOI machines on all SMT lines in the near future.
“By partnering with top market leaders like YESTECH, MC Assembly is making major improvements in early detection and process control capabilities,” said MC Assembly’s Chief Operations Officer Luis Ramirez. “This additional capability will allow us to provide our customers with complex PCBAs with an additional layer of inspection superior to the industry 2D standard AOI.”
Nordson YESTECH is a leading supplier of automated optical and conformal coat inspection systems for the electronics manufacturing industry. MC Assembly currently uses over 22 YESTECH AOI systems and one X-3 X-ray machine.
With the new FX-940 AOI machine, MC Assembly can provide its customers with cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs and other height sensitive devices.
The new machine features Advanced Fusion Lighting and comprehensive inspection tools including angled cameras, full-color digital image processing and both image and rule-based algorithms. The FX-940 ULTRA offers complete inspection coverage with unsurpassed 2D and 3D defect detection. The FX-940 ULTRA provides high-powered inspection with:
- 12 MP / 5 axis 3D NYTVISION Technology
- Complete 2D + 3D inspection capabilities
- One top-down and four side-viewing cameras
- Automatic programming tools: < 30 minutes
- High defect coverage / low false failures
- SPC data collection and reporting
About MC Assembly
MC Assembly (http://www.mcati.com), based in Melbourne, Fla., with additional operations in Billerica, Mass., and Zacatecas, Mexico, is a national leader in the contract manufacturing arena with annual revenues of approximately $200 million. It provides turnkey solutions to original equipment manufacturers and focuses on assembly of medium volume, medium mix printed circuit boards assemblies (PCBAs) and box builds. MC Assembly's capabilities include surface mount and pin-through-hole interconnection technologies, PCB and box build, DFM, DFT, DFA engineering, in-circuit, functional and environmental testing, and full box-build direct order fulfillment.
About Nordson YESTECH
Headquartered in Carlsbad, California, Nordson YESTECH is a leading provider of automated optical inspection systems with integrated yield enhancement solutions for the printed circuit board assembly and advanced semiconductor-packaging industries, Nordson YESTECH is operated and managed by a team of industry experts with a history of success, bringing powerful and cost-effective inspection to the electronics market. The company has sales offices and customer support centers in North America, Asia and Europe. For more information on Nordson YESTECH and its products, visit http://www.nordsonyestech.com.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries. Visit Nordson on the web at http://www.nordson.com.
Suggested Items
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.