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Alpha to Present at South East Asia Technical Training Conference on Electronics Assembly in Penang
March 27, 2017 | Alpha Assembly SolutionsEstimated reading time: 3 minutes
Alpha Assembly Solutions will be presenting two technical papers, "Flip-Chip LED Assembly – Processes and Challenges" and "LED Assembly on Flexible Substrates" at the South East Asia Technical Training Conference on Electronics Assembly Technologies 2017, which will be hosted by SMTA from March 28-30, 2017 at the Oliver Tree Hotel in Penang, Malaysia.
The paper titled "Flip-Chip LED Assembly – Processes and Challenges" will discuss the effect of application process, process settings and solder paste on assembly outputs. This study is relevant for LED packaging and LED module assembly makers who use flip chip for automotive, backlight and general lighting applications.
The second paper titled "LED Assembly on Flexible Substrates" will provide insights into the world of LEDs on flexible circuits. The presentation includes end-applications and drivers for LED on flex including material stack selection particularly, details on low- to mid-temp alloys and interconnects on both polyimide and PET based circuits. Additionally, the impact/performance of typical material stacks in the form of applications studies will be reviewed and lastly the future of flexible circuitry form factor evolution will be discussed.
TECHNICAL PAPER PRESENTATION:
Wednesday, 29th March 2017 | 03:00-03:30
Topic: Flip-Chip LED Assembly – Processes and Challenges
Speaker: Gyan Dutt, Technical Marketing Manager of LED – Alpha Assembly Solutions
Wednesday, 29th March 2017 | 04:00-04:30
Topic: LED Assembly on Flexible Substrates
Speaker: Amit Patel, Project Manager of LED – Alpha Assembly Solutions
Speakers’ Biography
Gyan Dutt works for Alpha as Technical Marketing Manager for LED Technologies. He is responsible for the planning, organization and implementation of the ALPHA® product portfolio for LED packaging, interconnect and assembly. He has more than 13 years of experience in technical marketing, product development and applications engineering in semiconductor packaging in the US and Asia-Pacific Regions.
Amit Patel is the Project Manager - Engineer, for the LED Technologies division at Alpha Assembly Solutions, South Plainfield, NJ. In his current role he is instrumental in planning, coordinating and executing market research, and applications research for the design and implementation of electronic assembly materials for all levels of LED manufacturing, from LED die attach to module/luminaire assembly. Amit holds a Bachelor’s degree in Electrical Engineering from The New Jersey Institute of Technology. He is also an trained Six Sigma Black Belt. He co-wrote the iNEMI Solid State Illumination Technology Working Group for the 2015 roadmap cycle So far, He has published 3 papers in the areas covering Assembly Processes, and Thermal Management for the solid state lighting industry.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox® and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet® products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, visit www.AlphaAssembly.com.
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