Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

Spirit Electronics Opens U.S. Semiconductor Manufacturing Access for Aerospace and Defense

06/15/2026 | Globe Newswire
Spirit Electronics announced a new managed-access offering that provides aerospace and defense customers with a secure pathway to advanced, U.S.-based semiconductor manufacturing in 28nm CMOS.

GlobalFoundries, Qualinx Demonstrate First European Sovereign Chip Manufacturing Flow

06/10/2026 | BUSINESS WIRE
GlobalFoundries (GF) and Qualinx announced the successful completion of the first fully European-based, end-to-end semiconductor manufacturing flow at GlobalFoundries’ Dresden fab on its FDX technology.

Getters, Thermal Management, and High-Reliability Packaging: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

06/10/2026 | I-Connect007
The upcoming issue of Advanced Electronics Packaging Digest explores several technologies shaping the future of advanced packaging, from maintaining stable environments inside hermetic packages to managing heat in increasingly complex 3D architectures. The issue also examines packaging innovations for aerospace, defense, and automotive applications, as well as broader connections between semiconductor interconnects and the systems they support.

RTX's Collins Aerospace Quadruples MRO Footprint in Malaysia

06/09/2026 | RTX
Collins Aerospace, an RTX business, has expanded its maintenance, repair and overhaul (MRO) facility at Subang Aerotech Park in Malaysia.

RTX's Collins Aerospace Opens Expanded Manufacturing Facility in Tajęcina, Poland

06/02/2026 | RTX
Collins Aerospace, an RTX business, has opened its newly expanded, 22,000 square-meter manufacturing facility in Tajęcina, Poland.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in