Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
HANZA Establishes Manufacturing Solution with Deliveries to Flexenclosure
March 29, 2017 | HANZA Holding ABEstimated reading time: Less than a minute
HANZA has signed an agreement with Flexenclosure, whereby HANZA will supply electrical parts from their manufacturing cluster in Årjäng, Sweden and host a final JIT (just in time) assembly line.
Flexenclosure provides sustainable Internet infrastructure for emerging markets – designing and manufacturing eCentre prefabricated data center buildings and eSite intelligent power management systems for the ICT industry. The company recently launched eSite x10 – the world’s first hybrid power system purpose-built for outdoor telecom sites and to outdoor telecom standards.
"Our new eSite x10 product is the future of hybrid power," said David King, CEO, Flexenclosure. "Its hardware and software engineering is pre-eminent in our industry and we needed to be sure that our manufacturing partner was pre-eminent in theirs. We're comfortable that with their high-tech experience and their proximity to our manufacturing hub in Sweden, HANZA is the ideal partner."
"Our concept is designed to deliver high customer value thru CAP (Competence, Automation and Proximity) to customers in countries like Sweden," said Thomas Lindström, Senior Vice President, Head of Business Solutions at HANZA. "This, we combine with our unique advisory services and complete manufacturing to develop a sustainable manufacturing strategy for our customers."
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.