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Kester to Showcase Latest Technologies at SMT Hybrid Packaging 2017
April 5, 2017 | KesterEstimated reading time: 1 minute
Kester will be exhibiting its latest solder paste products and fluxes at SMT Hybrid Packaging 2017, which will take place May 16–18, 2017 at the Exhibition Centre in Nuremberg, Germany. Kester will be in Booth 4-533.
At the event, attendees will have the opportunity to meet with the Kester sales team and learn more about Kester’s new products, including the NP545 a zero-halogen, lead-free, no-clean solder paste with a 12-month unrefrigerated shelf life; the NP505-HR a zero-halogen, lead-free, no-clean solder paste formula developed specifically for high-reliability applications; the NF372-TB a zero-halogen, no-clean, low solids liquid flux designed to withstand long dwell times and high preheat temperatures needed in thick board assemblies; and the SELECT-10, a zero-halogen no-clean liquid flux designed specifically for the needs of the selective soldering process.
About Kester
Kester is a global supplier of assembly materials for the Electronic Assembly and Semiconductor Packaging industries. Kester is focused on delivering innovative, robust and high-quality solutions to help our customers address their technological challenges. Kester’s current product portfolio includes soldering attachment materials such as solder paste, soldering chemicals, TSF (tacky solder flux) materials, and metal products such as bar, solid and flux-cored wire. Kester is an Illinois Tool Works (ITW) company. ITW is a Fortune 200 company that produces engineered fasteners and components, equipment and consumable systems, and specialty products. It employs approximately 49,000 people, and is based in Glenview, Illinois, with operations in 57 countries.
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Koh Young Appoints Tom Hattori as President of Koh Young Japan
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Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
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Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.