Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Alpha and Itecs to Exhibit at ExpoElectronica Show in Moscow
April 10, 2017 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions will be showcasing its range of product innovations alongside Itecs, its Distributor Partner for Russia, at the ExpoElectronica Show, which will be held from April 25–27, 2017 at the Crocus Expo in Moscow, Russia.
Alpha will present its latest stencils innovation ALPHA tensoRED Master Tensioning Frame. ALPHA tensoRED enables a higher and more even tension compared to ALPHA Tetra Frame. Due to its innovative design, no air pressure on the frame is needed, resulting in reduced maintenance costs and improved reliability.
Alpha's extensive range of solder paste and cored wire products such as ALPHA CVP-390 solder paste and ALPHA Telecore HF-850 Cored Solder Wire will also be showcased. ALPHA CVP-390 is a lead-free, zero-halogen no-clean solder paste designed to enable consistent fine pitch printing capability, down to 180µm circle printed with 100µm thickness stencil. ALPHA CVP-390 also exhibits excellent print volume deposit repeatability which provides value by reducing defects associated with print process variability.
ALPHA Telecore HF-850 Cored Solder Wire is the fastest wettest and lowest spattering, Halogen Free and Halide Free cored wire offering from Alpha. ALPHA Telecore HF-850’s clear residue also allows easy inspection of solder joints and the very low spatter rate ensures board cosmetics and user comfort is maintained.
For more information on Alpha’s product range please visit the Itecs stand #B627 or visit the Alpha website.
About Itecs
Based in Moscow, Russia, Itecs has been supplying electronic components to the Russian market since 2001. Alpha and Itecs have been working together for 17 years with Itecs appointed as Alpha’s official distributor for Russia in 2010.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.