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Saki to Demo Advanced 3D AOI Capabilities at NEPCON China
April 13, 2017 | Saki CorporationEstimated reading time: 1 minute
Saki Corporation will demonstrate the advanced capabilities and new extra component detection (ECD) feature of its BF-3Di 3D automated optical inspection (AOI) systems at NEPCON China on April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center in Shanghai, China, in booth 1J25.
Saki's ECD algorithm inspects for stray components, solder balls, and foreign materials across the entire surface of the circuit board and can detect objects of 200 microns or less, thereby eliminating these defects. ECD, coupled with the benefits of the complete scan of the PCB by Saki's line scan technology, provides further assurance of product quality. Saki's ECD is incorporated into both its 2D and 3D AOI systems.
Saki's systems handle all types of boards, including extra-large (686x870mm) PCBs. The BF-3 Di series uses multi-phase ring lighting and Saki's proprietary coaxial top light illumination to measure the solder height and accurately reconstruct the fillet geometry of the image. With the newly developed 4-way side cameras, it accurately detects J-leads, QFN packages, and connector assemblies via 4-way projection technology. These systems measure heights from 0-20mm with 1µm resolution and achieve full automation with very low false calls and zero escapes. In addition, Saki's BF-3 Di software reduces library creation time by over 50% when compared to conventional AOI machines.
About Saki Corporation
Since its inception in 1994, Saki has led the way in the development of automatic recognition through robotic vision technology, applying ground-breaking image processing tools to solve inspection problems associated with printed circuit board assembly. Saki Corporation has headquarters in Tokyo, Japan with offices and sales and support centers around the world. Saki has Quality Management System JIS Q 9001:2008 and ISO 9001:2008 certifications. For more information click here.
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