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Alpha to Showcase Preform Technology at National Electrical Wire Processing Technology Expo
April 14, 2017 | Alpha Assembly SolutionsEstimated reading time: 1 minute
Alpha Assembly Solutions will exhibit for the first time at the 17th Annual National Electrical Wire Processing Technology Expo taking place May 10 – 11 in Milwaukee, Wisconsin.
Alpha, a part of the MacDermid Performance Solutions group of businesses, will feature its innovative preform products and technology targeted for specific connector, wire harness, and wire process applications. Highlights will include preform solder sleeves, washers, and collars, available in high performance leaded and lead-free alloys, which are engineered to meet new environmental standards and demanding melting temperature requirements. Alpha will also feature its integrated flux and thermochromic indicator technology to certify solder joints.
“As a supplier for the Automotive, Aerospace, Defense and Marine industries, Alpha’s goal is to develop and provide next generation products to our customers and the connector processing industries“, said Jerry Sidone, Alpha’s Regional Product Manager for Preforms. “Our ability to provide low temperature, lead-free alloys in this traditional lead alloy market is one example of Alpha’s next generation of products.“
To learn more about Alpha Assembly Solutions and its next generation preform technology, please visit us at Booth #1318.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
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Rachael Temple - AlltematedSuggested Items
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Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.