-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Goepel electronic Offers Free Webinar on the Combined Advantages of 3D Solder Paste Inspection
April 18, 2017 | GOEPEL ElectronicEstimated reading time: 1 minute
Goepel electronic will be holding a webinar titled, "Detect Faults Early and Optimize Processes - Combined advantages through 3D Solder Paste Inspection", on Tuesday, May 9, 2017 at 11 AM EST.
3D SPI systems become increasingly commonplace and often play a critical role in today's SMT production line. It is very important to detect faults in early stages to effectively avoid subsequent and more costly faults in later downstream.
In this webinar, attendees will receive and overview of the technologies used for profiling the topography of solder and sinter pastes and learn the requirements of SPI systems and how flexibly such SPI systems can be used in the production environment. The webinar will also discuss concepts relating to the advantages of having connectivity between different inspection systems (SPI, AOI, AXI) as well as their connection to internal MES or traceability systems.
The following questions will also be addressed
- What technologies exist for effective inspection of solder paste?
- What are the requirements of an SPI system?
- What opportunities exist for the flexible usage of SPI systems?
- What has Industry 4.0 to do with the usage of SPI systems?
Goepel invites quality and production managers for electronic assemblies, technologists and production planners and CEOs and directors of electronic manufacturing companies to attend this FREE event.
About Goepel electronic
Goepel electronic is a worldwide leading vendor of innovative electronic and optical test and inspection systems, being the market leader for professional JTAG/Boundary Scan solutions for Embedded System Access (ESA). A network of branch offices, distributors and service partners ensures the global availability of the products as well as the support of system installations worldwide. Founded in 1991 and headquartered in Jena/Germany, Goepel electronic employs currently more than 230 employees and generated a revenue of 30 Million Euro in 2015. Goepel electronic has continuously been ISO9001 certified since 1996 and has been honoured with TOP-JOB and TOP-100 awards for being one of the best medium-sized companies in Germany. Goepel electronic’s products won several awards in recent years and are used by the leading companies in telecommunication, automotive, space and avionics, industrial controls, medical technology, and other industries. Further information about the company and its products can be found here.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.