Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Alpha to Feature Innovative Inks, Pastes and Adhesives at Upcoming IDTechEx Show in Berlin
April 18, 2017 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions is introducing a robust portfolio of product solutions for flexible, formable and printed electronics at the IDTechEx Show taking place on May 10th-11th in Berlin, Germany. Alpha will be exhibiting jointly with MacDermid Autotype, under the MacDermid Performance Solutions business at Booth #J23.
The ALPHA Product offering includes Silver Inks, Carbon Inks, Dielectric Inks, Solder Pastes and Electronic Adhesives that meet the demanding performance and reliability requirements of flexible and printed electronic circuits. These materials are ideal for:
- Flexible PCBs for assembly of conventional devices and packages such as ICs, Processors or MEMS on circuited flexible substrates.
- Printed Electronic Circuitry for fabricating membrane touch switches, sensors, RFIDs, etc.
“The high performance, flexibility and enhanced durability of Alpha’s new products are ideal for applications where consistency and convenience are important, such as membrane touch switches, automotive and other industrial controls”, said Dr. Bawa Singh, EVP of Technology and Corporate Development for Alpha Assembly Solutions. “This provides a substantial benefit on performance and cost to designers who are looking for high reliability materials to enable their sophisticated multilayer designs.”
Alpha’s sister company, MacDermid Autotype, will also be exhibiting within the same space, located at Booth #J23. They are a global supplier of high quality precision coated films and materials for use in Electronics, Automotive and Printing industries.
About IDTechEx
Since 1999 IDTechEx has provided independent market research, business intelligence and events on emerging technology to clients in over 80 countries. They provide clients with insights to help make strategic business decisions and grow their organisations. IDTechEx is headquartered in Cambridge, UK with additional offices in USA, Germany and Japan and associates in South Korea.
About MacDermid Performance Solutions
MacDermid Performance Solutions Business group of businesses supply innovative, functional products to a rapidly changing electronics marketplace. We research, develop and deliver specialty substrates and high performance environmental friendly materials that enable the manufacture of complex electronic circuits and assemblies.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive, flexible & printed electroncis and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.