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Alpha Recycling Services to Exhibit at SMTA Puget Sound Expo
April 21, 2017 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions will showcase their recycling services at the SMTA Puget Sound Expo and Tech Forum being held at Microsoft on May 8 in Redmond, Washington.
Alpha will exhibit at the show and representatives from ALPHA Recycling Services will highlight for electronic assemblers the safe, efficient solder recycling services that they offer.
"Alpha is committed to helping our customers by providing them with cost-efficient options to responsibly dispose of their solder dross and waste," said Patricia Mealey, Western and Central Reclaim Manager for Alpha. "Our experienced staff can help you minimize your environmental liability while maximizing your financial return for reclamation efforts."
ALPHA Recycling Services provides the safest, most efficient, environmentally-compliant solution for turning production waste streams into revenue for your company. Capable of processing all varieties of waste materials, Alpha has the technological edge for maximizing the recycling of solder paste and related solder paste debris, including used jars, dispensers, and stencil cleaning paper.
With expanded manufacturing capabilities in the Americas and Europe Regions, Alpha can take back metal waste streams and responsibly recycle that waste into high purity raw materials for re-use.
The Alpha Assembly Solutions website has additional information on Alpha’s unique process technology and its Recycling Services.
About SMTA
The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.
For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.
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Julia McCaffrey - NCAB GroupSuggested Items
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.