The Knowledge Base: My 2025 Industry Wish List
Global Sourcing Spotlight: The Surprising World of Offshore B2B Industrial Values
Nolan’s Notes: Emerging Trends in 2025
Rehm Thermal Systems Supports Fifth Kids' Kickabout
May 8, 2017 | Rehm Thermal SystemsEstimated reading time: 2 minutes
Obesity, concentration issues and an inability to perform simple coordination tasks are increasingly affecting our children. A lack of exercise can contribute to these problems. This is why Rehm Thermal Systems is involved in a variety of social projects aimed at getting children and young people more excited about sports and exercise. The end of April saw another Kids' Kickabout football day at the Blautopf School in Blaubeuren, already in its fifth year, in cooperation with Rehm, the Stuttgart football academy GOAL and the company FutureSport. It was a great success.
"Social involvement is a part of our company culture and helping children and young people is something that’s close to our hearts. That's why we have been supporting FutureSport's regional projects with financial and material donations for several years now. This way we can really get things moving for young people, in the truest sense of the word," says Johannes Rehm, Managing Director of Rehm Thermal Systems.
Kids' Kickabouts take place across the country. For pupils at the Blautopf School in Blaubeuren, the event has virtually become a tradition already. On April 26, 2017, about 47 third-grade pupils spent an entire day improving their football skills with professional coaches and strengthening their team spirit. Instead of Maths and German classes, warm-ups, coordination and football training techniques were on the timetable.
As a special highlight of this year’s event, a famous face made an appearance. "The brilliant support from our sponsors helped us book the former professional footballer and coach André Trulsen – who counts VFB Stuttgart, FC St. Pauli and 1. FC Köln among his former clubs – for the Kids’ Kickabout. His professional experience brought something extra special to the event and this day was once again a brilliant experience for the children at the Blautopf School," says Thomas Hilsenbeck, head teacher at Blaubeuren's Blautopf School.
Ralph Pfender, a project manager at FutureSport, is also enthusiastic about the sponsors' involvement. "Due to a lack of funds, the school usually only has the financial resources left to buy the essentials. Sponsoring allows us to give the children and young people the best opportunities to develop physically and mentally. We are immensely grateful to the sponsors for their support – these events couldn’t happen without them!"
About Rehm Thermal System
As a specialist in the field of thermal system solutions for the electronics and photovoltaics industries, Rehm is a technology and innovation leader in the modern and economical production of electronic modules. As a globally operating manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for the metallization of solar cells as well as numerous customer-specific special systems, we are represented in all relevant growth markets and, as a partner with more than 25 years of industry experience, we implement innovative manufacturing solutions that set standards.
Share on:
Suggested Items
SolderKing to Highlight Innovations in Soldering and Manufacturing Efficiency at Southern Manufacturing & Electronics 2025
01/08/2025 | SolderKing Assembly Materials Ltd,SolderKing, a leading UK manufacturer of advanced soldering materials and consumables, will be exhibiting at the Southern Manufacturing and Electronics Show from 4-6 February 2025 at the Farnborough International Exhibition Centre, Stand J90.
IPC Announces UK Regional Qualification for Hand Soldering Competition
01/02/2025 | IPCIPC invites skilled soldering experts to participate in the UK Regional Qualification for the IPC Hand Soldering Competition (HSC) on February 4-6, 2025, at the Farnborough International Exhibition Centre.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.