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Alpha to Host Low Temperature Assembly Technology Seminar in Suzhou, China
May 10, 2017 | Alpha Assembly SolutionsEstimated reading time: 2 minutes
Alpha Assembly Solutions will host a full day seminar on "Low Temperature Assembly Technology" on May 18, 2017 in Crowne Plaza Hotel in Suzhou, China.
The free seminar from Alpha, a part of the MacDermid Performance Solutions group of business, focuses on the current hot topic "Low Temperature Soldering". Topics include "A History and Overview of Low Temperature Solder Alloys", "A New Generation of Low Temperature Solder Alloys (HRL1)", "iNEMI Collaborative Effort on Low Temperature Soldering", "Low Temperature Soldering SMT Experiment" and also the newly coming soon to market "ALPHA OM-550 HRL1 Solder Paste" will also be introduced at the seminar.
"ALPHA OM-550 HRL1 represents the culmination of years of research and development, bringing SAC305-type mechanical and thermal reliability in a low temperature alloy to board level assemblies once thought impossible. ALPHA OM-550 HRL1 meets reliability requirements typical of motherboard and mobile assemblies, and supports our customers’ endeavor to reduce their carbon footprint without impacting performance. We are therefore excited to bring together representatives of our industry who have taken the first step towards reaping the benefits of this game changing class of materials in an event to share and showcase the results of their efforts at the Crowne Plaza Hotel in Suzhou," said Phua Teo Leng, Regional Product Manager of Solder Paste. "Alpha has had a long-standing history of being a leader in innovation and sustainability, and OM-550 HRL1 is yet another statement of Alpha's commitment to the industry that we support the transition to a low carbon economy."
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.
For the LED segment, Alpha offers its Lumet® products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information click here.
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