The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
SMTA China Presents Awards at SMTA China East Conference/NEPCON China 2017
May 15, 2017 | SMTAEstimated reading time: 1 minute
SMTA China announces that it presented awards for seven papers and two exhibits at the SMTA China East Conference 2017 Award Presentation Ceremony, held on Tuesday, April 25, 2017 at the Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.
Best Paper / Best Presentation Awards presented by SMTA China during the SMTA China East Conference 2017
Best Emerging Exhibit / Best Exhibit Technology Awards presented by SMTA China during the SMTA China East Conference 2017
Flex’s Henley Zhou was awarded The Best Paper of Technology Conference One for the paper titled “The Study of the Effect of PTH Diameter, Connection Type and Amount of Connected Copper On PTH Hole Fill Percentage By Wave Soldering.”
KYZEN’s Daniel Gao was awarded The Best Paper of Technology Conference Two for the paper titled “Cleaning Agent Innovation for Highly Dense Electronic Assemblies.”
Keith Bryant, from SMT Solutions, and Michael Tang, from YXLON International GmbH, received the award for The Best Presentation of Technology Conference One for the presentation titled “Computer Tomography from Microelectronics to Assembled Products.”
Dr. Wayne Koh, from Pacrim Technology Inc., received the award for The Best Presentation of Technology Conference Two for the presentation titled “Progress in Low Temperature Lead-Free Solder for SMT Assembly.”
Ji Xu, from ASM Assembly Systems Ltd., received the award for The Best Presentation of Vendor Conference One for the presentation titled “Smart #1 SMT Factory - Our Smart Move to Industry 4.0.”
Derek Wang, from AIM Solder (Shenzhen) Company Limited, received the award for The Best Presentation of Vendor Conference Two for the presentation titled “The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance.”
Yu Xiang, from Shenzhen City TongFang Electronic New-material Co., Ltd., received the award for The Best Presentation of Vendor Conference Three for the presentation titled “QFN Solder Void Solution Study.”
Dongguan Anda Automation Equipment Co., Ltd. received the award for The Best Emerging Exhibit of the Year 2017 China East with the product of “Dispenser Machine” and Model of “AD-16”.
Cencorp Automation Oy received the award for The Best Exhibit Technology of the Year 2017 China East with the product of “In-Line Router” and Model of “1000BR”.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.