Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
SMTA China Presents Awards at SMTA China East Conference/NEPCON China 2017
May 15, 2017 | SMTAEstimated reading time: 1 minute
SMTA China announces that it presented awards for seven papers and two exhibits at the SMTA China East Conference 2017 Award Presentation Ceremony, held on Tuesday, April 25, 2017 at the Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.
Best Paper / Best Presentation Awards presented by SMTA China during the SMTA China East Conference 2017
Best Emerging Exhibit / Best Exhibit Technology Awards presented by SMTA China during the SMTA China East Conference 2017
Flex’s Henley Zhou was awarded The Best Paper of Technology Conference One for the paper titled “The Study of the Effect of PTH Diameter, Connection Type and Amount of Connected Copper On PTH Hole Fill Percentage By Wave Soldering.”
KYZEN’s Daniel Gao was awarded The Best Paper of Technology Conference Two for the paper titled “Cleaning Agent Innovation for Highly Dense Electronic Assemblies.”
Keith Bryant, from SMT Solutions, and Michael Tang, from YXLON International GmbH, received the award for The Best Presentation of Technology Conference One for the presentation titled “Computer Tomography from Microelectronics to Assembled Products.”
Dr. Wayne Koh, from Pacrim Technology Inc., received the award for The Best Presentation of Technology Conference Two for the presentation titled “Progress in Low Temperature Lead-Free Solder for SMT Assembly.”
Ji Xu, from ASM Assembly Systems Ltd., received the award for The Best Presentation of Vendor Conference One for the presentation titled “Smart #1 SMT Factory - Our Smart Move to Industry 4.0.”
Derek Wang, from AIM Solder (Shenzhen) Company Limited, received the award for The Best Presentation of Vendor Conference Two for the presentation titled “The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance.”
Yu Xiang, from Shenzhen City TongFang Electronic New-material Co., Ltd., received the award for The Best Presentation of Vendor Conference Three for the presentation titled “QFN Solder Void Solution Study.”
Dongguan Anda Automation Equipment Co., Ltd. received the award for The Best Emerging Exhibit of the Year 2017 China East with the product of “Dispenser Machine” and Model of “AD-16”.
Cencorp Automation Oy received the award for The Best Exhibit Technology of the Year 2017 China East with the product of “In-Line Router” and Model of “1000BR”.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.