-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Mycronic Expands Next-Generation MYPro Series
May 17, 2017 | Mycronic ABEstimated reading time: 1 minute
Mycronic AB has launched a series of compact, high-capacity MY300 pick-and-place machines at the ongoing SMT Hybrid Packaging event in Nuremberg, Germany.
The MYPro series is the result of Mycronic's strategic product development within Business Area Assembly Solutions, focused on enabling the future of electronics with advanced production equipment. The SMT MY300 machine is the second release in the next-generation MYPro series. Recently, the Dispensing Division within Assembly Solutions launched the MY700 high-speed jet dispenser for solder paste and assembly fluids. The MY300 offers 40 percent higher space-productivity than previous models, making it possible to handle a wider range of components within a smaller machine footprint.
High-mix and high volume SMT manufacturers face growing product mixes and factory space constraints, together with a wider variety of miniaturized components. To meet these challenges, and as part of the Mycronic 4.0 intelligent factory solution, Mycronic is releasing the MY300 to increase productivity in a broad range of complex applications. The MYPro series allows Mycronic to address a larger market and an expanded array of SMT assembly applications.
The new MY300 provides a 40 percent smaller footprint than previous models. It also achieves higher speeds due to automatic job selection, rolling changeovers, as well as faster board transfer and tool changes. Throughput is increased significantly thanks to simultaneous assembly of multiple boards. Additionally, the improved linescan vision system ensures a future-proof solution for the most advanced components.
“Demands are constantly on the rise for higher degrees of automation, more component varieties and increased overall productivity – particularly among high-mix manufacturers,” says Robert Göthner, VP SMT, Assembly Solutions. “The MY300, built on a new compact and user-friendly platform design meets all of these needs for manufacturers of electronics.”
The MY300 will be available in three different models. the MY300DX, the MY300SX and the MY300LX, offering a wide range of highly automated line configurations for any intelligent factory.
About Mycronic AB
Mycronic AB is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, Taiwan, United Kingdom and the United States. For more information click here.
Suggested Items
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.