Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
ECT Launches Next Generation Probe for High Performance RF Signal Testing of PCBAs
May 19, 2017 | ECTEstimated reading time: 1 minute
Everett Charles Technologies (ECT) recently launched a high frequency test probe for the PCBA test market. The CSP-30ES-013 radio frequency probe mates to standard SMA connectors and combines proven RF performance with ease-of-use to ensure accurate and reliable testing. The CSP-30ES-013 coaxial probe provides an instrumentation-quality interface for broadband RF measurements in excess of 20 GHz, providing a cost-efficient solution for high volume board testing. With the addition of the CSP-30ES-013 high performance radio frequency probe, ECT expands its industry-proven high speed test interface portfolio.
The CSP-30ES-013 offers outstanding signal integrity and is capable of bandwidth measurements in excess of 20 GHz @ -1dB. With the CSP-30ES-013 RF probe, high frequency and functional tests can be performed in both high volume testing and engineering lab environments. Accurate small signal and RF power (50 Watts) measurements provide consistent and repeatable results. The CSP-30ES-013 ensures a consistent impedance of 50 Ohm.
The CSP-30ES-013 provides spring-loaded compliance for both the center signal probe and outer housing that provides ground contact. The articulated contact allows for targeting errors. The CSP-30ES-013 features a rugged design for inline applications and an easy to replace center conductor probe (SPL-30E-030). The knurl housing feature ensures easy and reliable press fit mounting.
Tony DeRosa, Senior Product Manager, confirms: “The CSP-30ES-013 probe meets the need for cost effective, high performance functional testing at high speed. Our engineers designed this probe to mate with SMA connectors and to provide excellent performance for our board test customers in both engineering characterization and high volume applications. It leverages Xcerra’s extensive knowledge in providing solutions for signal integrity sensitive applications, and we have over 15 years experience simulating complex test structures including probes, PCBA’s and launches. We build and test many structures to validate our products and corresponding models.”
Share on:
Suggested Items
Discover TRI Test Solutions at New-Tech 2025
05/08/2025 | TRIBynet Testing Systems, TRI's industry partner, will join New-Tech 2025 at EXPO Tel-Aviv, Pavilion 1 from May 20 – 21, 2025.
Datest Expands Presence in the Upper Midwest with Omni-Tec Partnership
05/05/2025 | DatestDatest, a trusted leader in advanced testing, engineering, inspection, and failure analysis services, is proud to announce its partnership with Gary Krieg of Omni-Tec, Inc. as its official sales representative in the Upper Midwest.
Northrop Grumman’s IVEWS Completes F-16 Electronic Warfare Operational Assessment
05/05/2025 | Northrop GrummanNorthrop Grumman Corporation’s IVEWS (Integrated Viper Electronic Warfare Suite) has successfully completed Operational Assessment flight testing on U.S. Air Force F-16 aircraft, demonstrating its effectiveness against advanced radar-guided threats.
Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
05/01/2025 | Cadence Design SystemsCadence announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK).
The Knowledge Base: Unlocking the Invisible—The Critical Role of X-ray Technology
04/29/2025 | Mike Konrad -- Column: The Knowledge BaseFrom detecting voids under BGAs to solder defects in high-reliability applications, X-ray inspection has become an indispensable tool in modern manufacturing. But how is the technology evolving? What challenges do experts face in deploying X-ray inspection effectively and what does the future hold for this critical quality assurance method?