Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
ECT Launches Next Generation Probe for High Performance RF Signal Testing of PCBAs
May 19, 2017 | ECTEstimated reading time: 1 minute
Everett Charles Technologies (ECT) recently launched a high frequency test probe for the PCBA test market. The CSP-30ES-013 radio frequency probe mates to standard SMA connectors and combines proven RF performance with ease-of-use to ensure accurate and reliable testing. The CSP-30ES-013 coaxial probe provides an instrumentation-quality interface for broadband RF measurements in excess of 20 GHz, providing a cost-efficient solution for high volume board testing. With the addition of the CSP-30ES-013 high performance radio frequency probe, ECT expands its industry-proven high speed test interface portfolio.
The CSP-30ES-013 offers outstanding signal integrity and is capable of bandwidth measurements in excess of 20 GHz @ -1dB. With the CSP-30ES-013 RF probe, high frequency and functional tests can be performed in both high volume testing and engineering lab environments. Accurate small signal and RF power (50 Watts) measurements provide consistent and repeatable results. The CSP-30ES-013 ensures a consistent impedance of 50 Ohm.
The CSP-30ES-013 provides spring-loaded compliance for both the center signal probe and outer housing that provides ground contact. The articulated contact allows for targeting errors. The CSP-30ES-013 features a rugged design for inline applications and an easy to replace center conductor probe (SPL-30E-030). The knurl housing feature ensures easy and reliable press fit mounting.
Tony DeRosa, Senior Product Manager, confirms: “The CSP-30ES-013 probe meets the need for cost effective, high performance functional testing at high speed. Our engineers designed this probe to mate with SMA connectors and to provide excellent performance for our board test customers in both engineering characterization and high volume applications. It leverages Xcerra’s extensive knowledge in providing solutions for signal integrity sensitive applications, and we have over 15 years experience simulating complex test structures including probes, PCBA’s and launches. We build and test many structures to validate our products and corresponding models.”
Share on:
Suggested Items
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
06/24/2025 | Dennis Fritz -- Column: Defense Speak InterpretedWhen I first published my Defense Speaks Interpreted column in January 2019 on the Defense Advanced Research Projects Agency (DARPA ERI), the agency advocated for an expanded Defense emphasis on closing the growing technology gap in microelectronics. The emphasis was on “resurgence.”
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/13/2025 | Marcy LaRont, I-Connect007Today is Friday the 13th, and in much of Western folklore, this is a day when bad luck is lurking. But while Friday the 13th may top Western superstition charts, the global calendar is sprinkled with its own unlucky legends. In Spain and Greece, the bad juju lands on Tuesday the 13th—a day linked to Mars, the god of war, and naturally, chaos. In Italy, it’s Friday the 17th that is feared, thanks to the Roman numeral XVII, which can be rearranged to spell VIXI—Latin for “I have lived” (a poetic way of saying you’re dead).
TTCI Celebrates Melanie Rutkauskas’ 10-Year Anniversary and Her Leadership of New Training Division
06/12/2025 | TTCIThe Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to celebrate Melanie Rutkauskas on her 10-year anniversary with the company.
Bridging the Knowledge Gap in Test: A Conversation with Bert Horner
06/11/2025 | Barry Matties, I-Connect007Bert Horner is a seasoned industry veteran and co-creator of The Test Connection, Inc. (TTCI), a test and inspection company spanning over 45 years. In this candid conversation, Bert reflects on the challenges our industry faces with the retirement of career professionals and the subsequent loss of critical tribal knowledge. As he unveils The Training Connection’s innovative training initiatives, Bert emphasizes the importance of evolving educational programs that align with industry needs, particularly in design for test (DFT), and sheds light on strategies being implemented to foster the next generation of engineers.