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Kyzen's Dr. Mike Bixenman Discusses Non-Standard Test Methods at ICSR
May 22, 2017 | KyzenEstimated reading time: 1 minute
Kyzen CTO Dr. Mike Bixenman will present at the International Conference on Soldering & Reliability (ICSR) being held in conjunction with the Toronto SMTA Expo & Tech Forum. Bixenman will present the paper entitled "Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach" at 2:30 pm on June 7, 2017 at the Edward Village Markham in Ontario.
Bottom terminated electronic components can fail from contamination trapped under the device. Non-standard test methods have been developed to perform site specific analysis of both contamination trapped under the bottom termination and reliability expectations based on the current assembly process conditions. These test methods allow an OEM to design a reliable assembly process by testing design factors, the selection of soldering materials, characterizing reflow conditions and cleaning processes.
The purpose of this research paper is to demonstrate the use of non-standard test methods to design printed circuit board features that allow the flux to outgas during reflow, test both ionic contamination and surface insulation resistance under a site specific component, selection of solder paste, reflow process conditions and optimization of the cleaning process. Data that helps an OEM determine up-front what does not work and the process conditions that do work will provide design conditions for building reliable electronic hardware.
Dr. Bixenman has more than 20 years of experience in the design of electronic assembly cleaning materials and process integration. He was the chair of the 2008 IPC/SMTA Cleaning Symposium and is the current chair of the IPC Cleaning Handbook Task Group. Dr. Bixenman holds four earned degrees including a Doctorate in Business Administration.
About Kyzen
Kyzen is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, Kyzen's innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, click here.
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