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Technica USA Showcases PCBA Supply Partners at IPC APEX EXPO 2025

03/13/2025 | Technica USA
Technica USA is thrilled to highlight its full portfolio of PCBA supply partners at the 2025 APEX/IPC Expo in Anaheim, California. Featuring some of the world’s leading suppliers, Technica’s PCBA product lineup continues to drive innovation and excellence in the industry.

TSMC and MediaTek Collaboration Paves the Way for Next-gen Wireless Connectivity

03/13/2025 | TSMC
MediaTek and TSMC announced that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.

EV Solid-State Battery Validation Accelerates in the U.S. and Europe, Mass Production Expected to Gradually Begin by 2026

03/13/2025 | TrendForce
TrendForce’s latest research reveals that solid-state batteries are emerging as the next-generation battery technology with high commercial potential. Manufacturers across the U.S., Europe, and other global markets are accelerating large-scale production development and performance validation for automotive applications. 

Eltek Reports Full Year and Q4 2024 Financial Results

03/13/2025 | Eltek
Eltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), today announced its financial results for the full year and fourth quarter ended December 31, 2024.

YINCAE: UF 158UL Redefines Underfill for Large Chips

03/12/2025 | YINCAE
YINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.
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