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Harwin Launches Three-point SMT Contact for High-Volume, Advanced Automated Assembly
May 30, 2017 | HarwinEstimated reading time: 1 minute
Interconnect component manufacturer Harwin has launched SYCAMORE, its latest surface-mount socket that provides superior pin retention and durability for high-volume applications manufactured using advanced automated systems. SYCAMORE’s design features three points of contact, providing the assurance of continuity and robustness previously only available from two-piece assemblies which are rarely available on tape & reel.Key markets for SYCAMORE include domestic and commercial gas detection systems, fire alarms and metering systems, plus many other applications that require modules and devices such as field-replaceable parts or temperature-sensitive components to be mounted to a PCB.
SYCAMORE, a single-part SMT socket design featuring a low profile of only 0.3mm above the PCB, is a unique, proprietary Harwin contact design with patents pending. Available in top and bottom entry versions, it accepts 1.0mm or 1.50mm diameter pins and is open-ended, therefore mating pin depth is not limited. Manufactured from beryllium copper, contacts are gold-plated to ensure high conductivity and durability over a temperature range of -50°C to +125°C.
“At Harwin, we understand the challenges of our customers right from design through to manufacturing and the unique contact design of our new SYCAMORE surface-mount socket addresses their need to apply advanced manufacturing processes for high volume output with no compromise on contact performance.” comments Robert Webber, Product Strategy Manager at Harwin.
About Harwin
Interconnect component manufacturer, Harwin, is known for innovation, automation, service and reliability. Having invented the Datamate 2mm pitch hi-rel connector family 25 years ago, the company has continued to develop this and other product families targeting applications where the connector ‘must not fail’. Relied upon by defence, aerospace, space, industrial, oil & gas, motorsport and other demanding industries, Harwin is accredited to EN 9100/AS9100C, the international quality system standard for the aerospace industry. Harwin’s portfolio of hi-rel interconnect solutions now also includes Mix-Tek mixed technology (signal, power, coax) styles, Gecko 1.25mm pitch products and high temperature M300 parts. The company’s full product range – which also features RFI & PCB Hardware and an extensive range of industry standard connectors – is available on short lead times through major distribution channels. Harwin’s direct sales and service extends worldwide via offices and manufacturing facilities in the UK, the USA, Germany, France and Singapore.
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Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
09/30/2025 | MacDermid Alpha & Graphic PLCMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.