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Indium Features WS-575-C Ball-Attach Flux at Microelectronics Tech Asia Singapore
June 8, 2017 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation will feature its WS-575-C Ball-Attach Flux at Microelectronics Tech Asia Singapore, July 4–5, 2017 in Singapore.
Indium's WS-575-C Ball-Attach Flux is halogen-compliant (no-intentionally-added halogens) and designed as a true one-step ball-attach process for Cu OSP substrates. WS-575-C eliminates many assembly issues, such as missing ball, weak joints, and voiding.
WS-575-C can be completely cleaned using room temperature deionized (DI) water, significantly reducing the costs of heating water.
For more information on WS-575-C Ball-Attach Flux, click here or visit Indium Corporation at Booth 14.
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