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Indium Corporation Technical Content Library on Void Reduction
June 13, 2017 | Indium CorporationEstimated reading time: Less than a minute
Voiding is one of the most prevalent challenges facing electronics manufacturers today, according to Christopher Bastecki, Associate Director of Electronics Assembly Materials at Indium Corporation. The company has spent years conducting extensive testing on materials and procedures to reduce voiding levels.
As a result, Indium provides one of the most extensive libraries on this subject to help members of the global electronics assembly industry solve their voiding challenges.
So far, Indium has published 35 technical articles, 24 blog posts, and 14 videos addressing this issue. These contents are available at www.indium.com/avoidthevoid.
About Indium
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com.
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