Global Sourcing Spotlight: How to Evaluate Supplier Capabilities Worldwide
The Knowledge Base: Cultivating Your Brand in the Age of Connection
SMT Perspectives and Prospects: Warren Buffett’s Perpetual Wisdom, Part 2
Indium Corporation Technical Content Library on Void Reduction
June 13, 2017 | Indium CorporationEstimated reading time: Less than a minute
Voiding is one of the most prevalent challenges facing electronics manufacturers today, according to Christopher Bastecki, Associate Director of Electronics Assembly Materials at Indium Corporation. The company has spent years conducting extensive testing on materials and procedures to reduce voiding levels.
As a result, Indium provides one of the most extensive libraries on this subject to help members of the global electronics assembly industry solve their voiding challenges.
So far, Indium has published 35 technical articles, 24 blog posts, and 14 videos addressing this issue. These contents are available at www.indium.com/avoidthevoid.
About Indium
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
SINBON Celebrates Opening of New US Manufacturing Facility
08/21/2025 | PRNewswireLeading electronics system integrator SINBON Electronics Co., Ltd. held an opening ceremony on August 18 to celebrate its new 59,000-square-foot facility in Clayton, Ohio.
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
Nano Silver Inks Market Forecast Report 2025-2030
08/20/2025 | Globe NewswireThe Nano Silver Inks Market is expected to grow from USD 427.415 million in 2025 to USD 836.160 million in 2030, at a CAGR of 14.36%.
VVDN Expands Manufacturing Footprint into the UAE to Meet Global Demand
08/20/2025 | PRNewswireVVDN Technologies, a global provider of software, product engineering and electronics manufacturing services & solutions, today announced it is setting up a new manufacturing facility in the UAE as part of its global expansion strategy.
Kimball Electronics Veterans ERG Members Proudly Participate in the 5th Annual Honor and Remember Run
08/20/2025 | Kimball ElectronicsVeterans and Military Service Advocacy (VMSA) Employee Resource Group (ERG) members Michael Mosher (Database Administration Engineer), Michael Stone (Test Technician Team Lead), and Joshua Belcher (Application Development Manager) took part in the 5th Annual Honor & Remember Run, a meaningful event dedicated to honoring fallen service members. The race featured a powerful memorial wall constructed from dog tags.