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Indium Features Reinforced Solder Preforms at NEPCON South China 2017
June 15, 2017 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS, at NEPCON South China 2017, which will be held from August 29–31 in Shenzhen, China.
Indium is redefining solder with its InFORMS solder preforms. InFORMS are a composite preform consisting of solder and a reinforcing matrix. Together, lateral strength is increased and bondline co-planarity is improved. In addition, superior thermal cycling reliability can be achieved.
When InFORMS were used to solder a DBC to the baseplate of an IGBT, one study showed:
- 4x improved thermal cycling reliability compared to a solder preform-only approach
- 2x improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
- Reduced voiding
- Lower cost of ownership – as a drop-in replacement for a standard preform or solder paste, InFORMS require no additional process steps or equipment
For more information about InFORMS, visit www.indium.com/informs.
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