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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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CPO Optical-Electrical Testing Drives Test Equipment Supply Chain Shift

10/13/2026 | TrendForce
TrendForce’s latest research on AI interconnect technologies reveals that growing demand for high-speed transmission in AI data centers is accelerating the transition of co-packaged optics (CPO) toward mass production, making shorter test times and lower costs increasingly important.

Elephantech to Open Toyosu Advanced Packaging Center

10/08/2026 | Elephantech
Elephantech Inc. announces plans to commence operations at its new Toyosu Advanced Packaging Center (Toyosu APC) in March 2027.

Trio-Tech Secures $4.45M Burn-In Equipment Contract

10/08/2026 | BUSINESS WIRE
Trio-Tech International, a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, announced it has secured a new three-year contract valued at approximately $4.45 million to provide burn-in testing equipment and ongoing technical and maintenance support to an existing European automotive semiconductor customer.

OEM-Refurbished MFP and Printer Demand Grows 14.5% in 1H 2026

10/07/2026 | IDC
The worldwide market for OEM-refurbished multifunction printers (MFPs) and printers strengthened in the first half of 2026, according to the IDC Worldwide Semiannual Refurbished MFP/Printer Tracker.

Yank Technologies Wins NASA Contracts for Lunar, Mars Wireless Power

10/06/2026 | PRNewswire
Yank Technologies, a leader in long-range, high-power wireless charging, has been awarded two NASA Small Business Innovation Research (SBIR) Phase I contracts to advance new wireless power technologies for robotic systems operating on the Moon and Mars.
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