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Indium's Andy Wei to Present at IPC WorksAsia Shenzhen Technical Conference
June 16, 2017 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation's Andy Wei, PCBA Product Manager for China, will share his technical expertise at the IPC WorksAsia Technical Conference (Shenzhen) on June 23 in Shenzhen, China. The conference focuses on automotive electronics reliability.
Wei's presentation, "High-Reliability Alloy Solder Paste for Automotive Applications", will discuss an overview of the automotive electronics market; key performance requirements for automotive electronics; and details on how to achieve high-reliability in automotive applications.
Wei provides technical support for Indium's electronics assembly materials for customers in China. He has more than 14 years of experience in electronics assembly, providing field support for soldering materials and SMT process applications. Wei earned his degree in electric engineering and automation from Zhengzhou Industrial Academy. He is an SMTA-Certified Process Engineer and is a Six Sigma Green Belt.
About Indium
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, click here.
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