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Lenthor Engineering Boosts Speed with Fuzion Platform from Universal
June 26, 2017 | Lenthor EngineeringEstimated reading time: Less than a minute
Lenthor Engineering, a California based designer, manufacturer and assembler of flex and rigid-flex printed circuit boards, has recently invested in a new Fuzion Platform from Universal. The dual-beam Fuzion 2-37 is a high performance multi-function solution that when added to Lenthor’s existing line will greatly boost production speed.
The Fuzion platform leverages the latest generation of head and feeder technologies and software tools and maximizes flexibility, effectiveness and productivity, at high volumes, without limitations. It will reduce setups, increase output, streamline changeover and promote a lean environment with smaller lot sizes, reduced WIP and increased turns,
“We’re excited about the possibilities this new platform brings to our assembly line, specifically when it comes to speed. The Fuzion will allow us to place an additional 35,000 components per hour,” says Matt Kan, Lenthor Engineering’s Assembly and EMS Director.
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Future-proof Laser Depaneling for PCBs with Photonics
04/10/2026 | Real Time with... APEX EXPOBill Solari of Photonics Systems USA outlines the advantages of laser depaneling for circuit board manufacturing. We learn that this advanced technology addresses rising material costs by increasing panel yield and improving edge quality. This process provides precision, suitability for medical applications, and cost-saving benefits, including the elimination of cleaning steps. There have been significant advancements in laser depaneling, offering a competitive and efficient solution for modern electronics production.
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