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VeCS HDI Process Technology: Has the Time Come for Broader Adoption?

08/25/2026 | Joan Tourné, NextGIn Technology BV
Packaging technology has always driven the PCB, but today's AI and high-performance computing devices are accelerating that relationship. As compute density, bandwidth, and power requirements increase, package, substrate, and PCB design become more interdependent. Modern AI processors, such as NVIDIA's Blackwell architecture, require thousands of package connections, support multiple stacks of high-bandwidth memory (HBM), and can dissipate as much as 1,000 watts of power or more. These demands are driving new approaches to package substrates, redistribution layers (RDLs), thermal management, and PCB fabrication, where manufacturing itself is becoming a limiting factor.

3 Key Takeaways From a New White Paper on Component Salvage

08/25/2026 | I-Connect007
Electronic waste is typically discussed in terms of recycling, but recycling is only one way to recover value from discarded electronics. In the white paper “Salvaging Electronic Components: A Reliable Method for Reducing Electronic Waste, and Ensuring Economic Reuse,” Nash Bell, president of BEST Inc., examines a different approach: harvesting high-value components from obsolete or superseded PCBs, reconditioning them, and putting them back into service.

Coherent Begins Sampling 300mm SiC Substrates for AI Infrastructure

08/24/2026 | Coherent
Coherent Corp. , a global leader in photonics, announced that it has begun sampling of its 300mm high thermal conductivity silicon carbide (SiC) substrates to leading AI semiconductor partners.

MKS to Showcase Advanced PCB Technologies at THECA 2026

08/24/2026 | MKS Inc.
During the conference, MKS experts will present two technical presentations addressing closed-loop digital process control and the evolving PCB technology requirements of AI, high-performance computing and data center infrastructure.

It’s Only Common Sense: Customers Need Confidence More Than Low Prices

08/24/2026 | Dan Beaulieu -- Column: It's Only Common Sense
It’s a business myth that customers buy primarily on price. This belief has shaped sales strategies for decades, but after more than 40 years working with electronics manufacturers, OEMs, and EMS providers around the world, I have learned this simply is not true. Customers are actually looking for the lowest risk. From AI to advanced manufacturing technologies, we are producing products that would have seemed impossible only a few years ago. Every new product carries enormous expectations, and every supplier becomes an important part of that customer's success. In an environment like this, confidence has become one of the most valuable products any company can offer.
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