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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Smartphone Shipments in China Fall 15.4% in Q3 Amid Rising Costs

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According to the IDC Worldwide Quarterly Mobile Phone Tracker, China’s smartphone shipments dropped 15.4% YoY to approximately 57.9 million units in the third quarter of 2026, marking an accelerated decline from the first half of the year.

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The Marketing Minute: Marketing Is a Team Sport

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Last week, my colleagues and I traded our desks and daily responsibilities for a team-building scavenger hunt in Schaumburg, Illinois. Armed with clues, we spent the afternoon in small groups tracking down local landmarks, taking ridiculous, posed photos, and working together to complete challenges that had very little to do with our actual jobs. Or so I thought.

I-Connect007 Launches Voices of the Industry Podcast Featuring NCAB Group’s Kelly Davidson

10/13/2026 | I-Connect007
I-Connect007 is pleased to announce the release of a new episode of Voices of the Industry, featuring Kelly Davidson, the new president of North American operations for NCAB Group. The PCB industry is navigating significant change, from economic uncertainty and shifting global supply chains to evolving customer demands and increasingly complex technology requirements. Amid these shifts, Davidson stepped into her new leadership role in December of 2025.

From Resilience to AI Infrastructure: Key Insights from 2026 Electronics Day EMS Europe

10/13/2026 | Anastasia Ederer, Global Electronics Association
On Sept. 17, the 2026 Electronics Day EMS Europe brought together executives, manufacturers, policymakers, and industry experts for a full day of discussion on the challenges and opportunities facing Europe’s electronics ecosystem. Across four sessions, the conversation spanned the electronics value chain. It began with European resilience and competitiveness, moved into the latest EMS market outlook, examined the infrastructure behind the rapid expansion of AI, and concluded with the growing pressures affecting PCB materials and manufacturing capacity.
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