-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueTechnical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
The Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
TopLine Intros Large Scale QFN Daisy Chain Test Package
July 7, 2017 | TopLineEstimated reading time: Less than a minute
TopLine now produces very large size 12x12mm daisy chain QFN components with dummy silicon die for use in a variety of SMT process and thermal profile testing applications. These large-size, bottom terminal QFN packages feature 100 pins, spaced very fine pitch at 0.4mm. The package size conforms to JEDEC standards with package height not exceeding 1.0mm. The terminals and ground pads are plated with nickel palladium gold (Ni Pd Au) to optimize SMT soldering.
The package level daisy chain circuit, made with 25µm gold bonding wire, forms an electrical connection between pads. These zero-ohm connections may be used to monitor electrical opens and shorts so that one may forensically determine the cause of PCB circuit board failure with simple GO/No-Go techniques using an ohm meter. Operating temperature range from -65⁰C to +150⁰C.
Other applications include PCB circuit board cleanliness testing incorporating SIR (surface insulation resistance) monitoring.
About TopLine
TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers. TopLine is a one-stop source for all dummy components. For more information, visit http://www.topline.tv/.
Suggested Items
Bridging the Gap: Workforce Collaboration in East Texas
02/13/2025 | Cory Blaylock, IPCIPC has partnered with Stephen F. Austin State University's (SFASU) Center for Applied Research and Rural Innovation (CARRI) and the IPC Education Foundation on a transformative project aimed at aligning academic training with real-world demands in electronics manufacturing.
Rehm Thermal Systems Brings Pioneering Manufacturing Technologies to productronica China 2025
02/11/2025 | Rehm Thermal SystemsRehm Thermal Systems will be presenting its further developments in areas such as convection soldering under vacuum, condensation soldering, coating and dispensing in Hall E4 of the Shanghai New International Expo Centre from 26 to 28 March.
Incap Slovakia Enhances SMT Quality with Automated Paste Inspection
02/07/2025 | IncapAt Incap Slovakia, quality and efficiency are at the core of our Surface Mount Technology (SMT) production. To further strengthen process control and minimise defects, we have implemented Automated Paste Inspection (API)—a high-precision system that ensures the accuracy and consistency of solder paste printing.
AIM Solder Acquires the Assets of Canfield Technologies
02/07/2025 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials, is pleased to announce the acquisition of the assets of Canfield Technologies, a renowned producer of high-quality solders and fluxes since 1844.
Delvitech to Officially Present Hybrid AOI + SPI Horus System at IPC APEX EXPO 2025
02/06/2025 | DelvitechDelvitech is happy to announce that it will showcase its groundbreaking Horus system, the industry's first all-in-one AI native platform for both Automatic Optical Inspection (AOI) and Solder Paste Inspection (SPI), at the upcoming IPC APEX EXPO 2025. The event is scheduled from March 18 to 20, 2025, at the Anaheim Convention Center in Anaheim, California.