-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
SMTA Capital Chapter Expo and Tech Forum to be Held on August 24
July 11, 2017 | SMTAEstimated reading time: Less than a minute
The SMTA Capital Chapter is inviting the industry to its upcoming Capital Expo and Tech Forum, which will be held at Johns Hopkins University/Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, Maryland, on August 24.
During this year's expo, the Capital Chapter will host technical presentations by ITM Consulting, Summit Interconnect, and GVD Corp. Specific topics include "The 'Deadly Sins' of SMT Assembly," "Density, Advanced Materials and Cost Drivers Associated with Advanced Circuit Design, Fabrication and Assembly," and, "Reliability without Hermeticity: Commercial Vapor Deposited Coatings for High-Frequency RF Micro-Electronics."
Registration opens at 8 am and includes a complimentary lunch on the show floor. Exhibits are open from 9-3 pm and the first technical presentation will start at 9:30 am.
To register online to attend or exhibit, please click here.
Suggested Items
Happy’s Tech Talk #36: The LEGO Principle of Optical Assembly
01/14/2025 | Happy Holden -- Column: Happy’s Tech TalkDr. Steven Case of Avanti Optics Corporation once advocated a new approach to photonic assembly, based on the LEGO principle. He compared today’s erbium-doped fiber amplifier (EDFA) technology to the crude point-to-point wiring of early model circuit boards, which gave way to modern circuit boards that could be considered prefabricated interconnects.
SMTA Hosts Ultra High Density Interconnect Symposium
12/31/2024 | SMTAThe Surface Mount Technology Association (SMTA) is pleased to announce the Ultra High Density Interconnect (UHDI) Symposium, taking place on Thursday, January 23 2025, at the Peoria Sports Complex in Peoria, Arizona.
SP Manufacturing Expands with New Malaysia Plant, Acquires Ideal Jacobs
12/26/2024 | PRNewswireSP Manufacturing (SPM), a leader in Electronic Manufacturing Services (EMS), is strengthening its global presence with two major moves: opening a new manufacturing facility in Senai, Malaysia, and successfully acquiring Ideal Jacobs Corporation.
Flex Factory Recognized for Manufacturing Excellence and Continuous Improvement by the Association for Manufacturing Excellence
12/19/2024 | FlexFlex announced that its Zhuhai, China site, specializing in advanced assembly, tool design and manufacturing, and metal and plastics capabilities for Lifestyle and Data Center customers, received an Excellence Award from the Association for Manufacturing Excellence (AME) for demonstrating world-class continuous improvement and results. This is the third consecutive year a Flex facility received an AME Excellence Award.
Mycronic Introduces New Machine Models to Its High-Performance Pick-And-Place Platform MYPRO A40
12/06/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, is introducing two new machine models MYPro A40SX and A40LX to its next-generation MYPro A40 pick-and-place platform, equipped with the all-new MX7 high-speed mounthead technology.