Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Rehm Thermal Systems at EFX 2026: Practical Expertise and Innovative Solutions for Electronics Manufacturing

08/05/2026 | Rehm Thermal Systems
Rehm Thermal Systems will provide answers to these and other key questions from October 6 to 8, 2026, at the inaugural EFX – Expo for Electronics Manufacturing in Stuttgart.

Powering the Future: Performance Is Won in Assembly

08/05/2026 | Brian Buyea -- Column: Powering the Future
There’s a moment in every design cycle when the conversation shifts from the elements of a substrate—material selection, thermal conductivity, circuit density, layout, and performance on paper— to the how it performs in assembly. No matter how good your substrate is, if the assembly isn’t right, none of it matters. Engineers are coming to terms with the fact that performance is more than the circuit. It’s now about the system, and that’s where assembly stops being an afterthought and becomes the whole game.

Dymax Launches 9310 Adhesive for High-Reliability PCB Reinforcement

07/30/2026 | Dymax
Dymax, a global manufacturer of light-curing materials and equipment, announces the launch of its 9310 adhesive engineered to reinforce fine-pitch, leadless components on printed circuit boards.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/23/2026 | Marcy LaRont, I-Connect007
In this week’s top five must-reads, I chose articles that go from big business questions (to diversify or not), to important technical issues such as DFM errors made in creating HDI designs using ELIC and design for test, to a discussion around some of the power and thermal considerations in advanced packaging, and the fact that they are now, firmly, performance enablers, not after-the-fact elements to be managed in fabrication.

Fresh PCB Concepts: IPC-6012 Class 3 and High-reliability PCB Manufacturing

07/23/2026 | Team NCAB -- Column: Fresh PCB Concepts
IPC-6012 Class 3 is widely recognized as the benchmark for high-reliability manufacturing. Compared to Class 2, it establishes tighter requirements for plated holes, annular rings, copper wrap, conductor integrity, and inspection criteria. Those requirements reduce manufacturing defects and improve overall product quality. A common misconception is that a Class 3 PCB is inherently reliable. It isn't. IPC-6012 is fundamentally a workmanship and performance specification that defines manufacturing acceptability after the design is complete.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in