Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
TRI to Redefine High-Speed Inspection at NEPCON South China
July 19, 2017 | TRIEstimated reading time: 1 minute
Test Research Inc. (TRI) will feature a new generation of high-performance SPI, AOI, AXI and ICT inspection solutions at the NEPCON South China 2017 exhibition, which will be held from August 29–31, 2017, at the Shenzhen Convention & Exhibition Center. TRI will be in Booth 1E65.
TRI's new 2017 lineup introduces the TR7600 SIII 3D CT X-ray inspection, which brings together exceptional imaging quality, ultra-high performance and smart inspection software in the industry's most advanced 3D AXI solution.
The TR7500QE stop-and-go 3D AOI system is designed for best inspection coverage with maximum accuracy with 2D+3D clear image and accurate 3D solder inspection. Now featuring CoaXPress for industry leading inspection performance.
The full lineup is joined by TR7007Q, a high accuracy 3D SPI designed for industry's smallest SMT components, and completed by TRI's award-winning ICT solution TR5001D SII INLINE, which features latest parallel testing technology and almost unlimited expandability.
Discover how TRI's complete range of PCBA test solutions works together to bring you maximum value in production line and minimize production costs. All TRI solutions are designed to interoperate with other manufacturing equipment; by integrating with YMS 4.0 yield management solution and Industry 4.0-based productions, they can help to minimize down times, optimize production quality and reduce operator work load.
About TRI
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. For more information, click here.
Share on:
Suggested Items
KYZEN to Highlight Stencil and Cleaning Solutions at SMTA Monterrey
03/27/2025 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, April 10 at the Cintermex Convention Center in Monterrey, Nuevo León. KYZEN cleaning experts will be on-site highlighting stencil cleaning chemistries KYZEN E5631J and CYBERSOLV C8882.
Indium to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
03/26/2025 | Indium CorporationAs a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.
SolderKing Enhances Brainboxes' Electronics Manufacturing with Expert Support and Advanced Materials
03/26/2025 | SolderKingIn modern electronics manufacturing, success relies on more than high-quality soldering materials. Technical knowledge and process expertise are just as crucial for achieving consistent results. SolderKing, a leading UK manufacturer, provides both, combining advanced consumables with specialist support to help manufacturers optimise their soldering processes.
AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Monterrey Expo & Tech Forum
03/20/2025 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Monterrey Expo & Tech Forum taking place on April 10 at Cintermex in Monterrey, Nuevo Leon, Mexico.
Hentec Industries/RPS Automation to Showcase Valence 2508 at IPC Expo 2025
03/17/2025 | Hentec Industries/RPS AutomationThe Valence 2508 Selective Soldering System is engineered for high-mix, high-volume, advanced PCB production. It supports boards ranging from 25 x 25 mm to 559 x 559 mm (1 x 1 in. to 22 x 22 in.), with a maximum processing area of 508 x 508 mm (20 x 20 in.).