Global Sourcing Spotlight: Tariffs—The New Reality
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
TRI to Redefine High-Speed Inspection at NEPCON South China
July 19, 2017 | TRIEstimated reading time: 1 minute
Test Research Inc. (TRI) will feature a new generation of high-performance SPI, AOI, AXI and ICT inspection solutions at the NEPCON South China 2017 exhibition, which will be held from August 29–31, 2017, at the Shenzhen Convention & Exhibition Center. TRI will be in Booth 1E65.
TRI's new 2017 lineup introduces the TR7600 SIII 3D CT X-ray inspection, which brings together exceptional imaging quality, ultra-high performance and smart inspection software in the industry's most advanced 3D AXI solution.
The TR7500QE stop-and-go 3D AOI system is designed for best inspection coverage with maximum accuracy with 2D+3D clear image and accurate 3D solder inspection. Now featuring CoaXPress for industry leading inspection performance.
The full lineup is joined by TR7007Q, a high accuracy 3D SPI designed for industry's smallest SMT components, and completed by TRI's award-winning ICT solution TR5001D SII INLINE, which features latest parallel testing technology and almost unlimited expandability.
Discover how TRI's complete range of PCBA test solutions works together to bring you maximum value in production line and minimize production costs. All TRI solutions are designed to interoperate with other manufacturing equipment; by integrating with YMS 4.0 yield management solution and Industry 4.0-based productions, they can help to minimize down times, optimize production quality and reduce operator work load.
About TRI
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. For more information, click here.
Share on:
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.