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Metcal HTD Tips Help Avoid Component and PCB Damage
July 20, 2017 | MetcalEstimated reading time: 1 minute
Metcal has launched the new High Thermal Demand (HTD) Solution for the MX-5200 Series. The HTD hand-piece and tips transform an MX-5000 or MX-5200 series into a powerhouse for applications with high thermal loads – such as dense boards – without damaging sensitive components.
Metcal's HTD solution delivers more thermal energy, thus efficiently minimizing the risk of component or printed circuit board damage associated with leaving a soldering iron tip on the solder joint for extended periods. The system provides a boost in performance by more effectively delivering thermal energy to the most demanding loads.
The HTD Solution can meet the most demanding requirements. It reduces the risk of prolonged soldering contact and improves time to manufacture while maintaining the comfort of the sleek and ergonomic hand-piece that you're used to. Its slimmer tips allow you to meet high thermal demand needs in a smaller form factor – getting the tip into areas industrial soldering irons cannot reach.
About Metcal
Since 1982, Metcal has been the recognized technology innovator in the OEM and global electronics assembly marketplace for the automotive, aerospace, medical devices and military sectors. Metcal provides advanced technology products across hand soldering, convection rework, fume extraction, and fluid dispensing applications. Its products continue to set the standard for performance, reliability, flexibility, and ROI, and are available from authorized distributors in North America and around the world. For more information, click here.
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Brent Fischthal - Koh YoungSuggested Items
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On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
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Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.