-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Saki America Appoints Alex Malek as Vice President Sales & Service, North America
July 25, 2017 | Saki CorporationEstimated reading time: 2 minutes

Saki Corp. announces the selection of Alex Malek as vice president of sales and service for North America and Sivilay (Nick) Sengmany as an application/field service engineer.
Malek will head sales and service for Saki's 2D and 3D automated optical, 3D automated solder paste, and 3D in-line x-ray measurement and inspection systems in the US and Canada. He will also be actively involved in continuing Saki's development, coordination, participation in, and leadership of the Industry 4.0/Smart Factory initiative.
Malek has many years of experience in the global Electronics Manufacturing Services and supply chain markets. Most recently he was president and owner of Operation Excellence Inc., a California Corporation. Operation Excellence provided consulting services for small and start-up high-technology companies in the areas of global operations management, global supply chain management, automation, quality, business development, sales, and marketing. Prior to that he held the positions of senior director of global supply chain and material for Bruker Nano Surfaces, senior VP for global supply chain and material for Flextronics's FlexPower, VP of global business development for Lean Stream, and senior global commodity manager in charge of capital equipment for Sanmina-SCI Corporation. Malek holds a BS degree in Industrial and Systems Engineering from San Jose State University and is a graduate of the Stanford Executive Program from the Stanford Graduate School of Business in Stanford, California.
As part of Saki's growth in North America, Sengmany, who is based in Virginia, has joined Saki to support customers and the Saki team with installation, training, and support of all Saki inspection and measurement systems. Before joining Saki, Sengmany was a process engineer/SMT lead for Sutron, Inc. and a field service engineer for Apex Factory Automation.
"Although Saki has been in business since 1994, we started our Americas expansion in 2014. Since then, we've expanded our facilities, the Saki representative network, and our sales and support team. With increased business in the Americas, and to continue our emphasis on customer satisfaction and local support, we are adding even more application engineers and increasing our sales representative network," explained Satoshi Otake, general manager of SAKI America. "We are excited that Alex has joined our team, as he brings a strong knowledge base and years of experience working with companies of all sizes and a wide array of products and requirements. Along with Nick, we can ensure that Saki customers have the inspection and measurement capabilities they need for success."
"I am delighted to be a part of Saki's team," Malek stated. "I have had the pleasure of knowing Saki and its team for many years. I have always been very impressed with their products -- on the hardware side with their reliability, quality, capability, and performance and on the software side with programming, inspection, measurement, imaging, and data capture capabilities. I truly believe that Saki's systems are the best on the market and that they provide the lowest total cost-of-ownership among our competitors. I plan to assure that our customers feel the same."
About Saki Corporation
Since its inception in 1994, Saki has led the way in the development of automatic recognition through robotic vision technology, applying ground-breaking image processing tools to solve inspection problems associated with printed circuit board assembly. Saki Corporation has headquarters in Tokyo, Japan with offices and sales and support centers around the world. Saki has Quality Management System JIS Q 9001:2008 and ISO 9001:2008 certifications.
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.