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Essemtec to Show All-in-One Jetting/Placement System at SMTA Capital Expo
July 26, 2017 | EssemtecEstimated reading time: 1 minute
Essemtec will exhibit at the SMTA Capital Show, scheduled to take place on Aug. 24, 2017. The company will demonstrate the FOX2, which combines jetting of solder paste or glue and placement in a single machine.
In many electronics production plants, new product introductions and prototype runs are still considered special processes. As as a result, certain aspects are rushed during the ramp-up, and ongoing production runs can suffer from excessively long and expensive interruptions. Using Essemtec‘s all-in-one solutions, you can stop this by establishing consistent, highly efficient and reliable NPI processes.
FOX2 has a machine footprint of just 1 square meter and can accept PCB sizes up to 16 x 12". Larger PCB machines are available. Components with sizes from 01005 up to 1.3 x 3.1" are placed. The machine achieves 10,800 cph (IPC9850) with the release of ePLACE 23 and still provides 50 µm accuracy, 3 sigma with a two nozzle head.
About Essemtec AG
Essemtec AG is a privately held Swiss equipment manufacturer, specializing in high speed fluid dispensing as well as flexible high-mix SMT placement solutions. Both divisions leverage the company’s vast equipment and process know-how gained since 1991 to let their customers achieve significant competitive advantages. The company’s goal is to improve its customers’ workflows, setup times, defect rates, traceability and overall manufacturing efficiency through superior software and by providing managed SMT storage.
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