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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Zuken Launches E3.series 2017
July 28, 2017 | ZukenEstimated reading time: 3 minutes
Zuken has launched E³.series 2017, which marks another milestone in the continuous evolution of Zuken’s powerful electrical, wire harness, and fluid engineering design tool. The latest release contains new and enhanced functionality that further increases productivity throughout all phases of engineering, from design to manufacture. New third party integrations extend the E3.series ecosystem of solutions.
Zuken’s E3.series is a Windows-based, scalable, easy-to-learn system for the design of wiring and control systems, hydraulics and pneumatics. Its object-oriented architecture provides an integrated and consistent design approach to help eliminate errors, improve quality and reduce design time.
Enhancements in E³.series 2017 cover all main E³.series modules: E³.schematic, E³.cable, E³.panel, E³.formboard and E³.PLC Bridge.
Schematic capture and documentation
E3.schematic helps electrical engineers design and document electrical control systems including schematic diagrams, terminal plans and PLCs. E3.cable is used for designing and documenting cable plans and harness layouts. New feature highlights in E³.schematic and E3.cable include:
- ‘Auto Route by selection’ allows interactive autorouting of two selected pins.
- ‘Insert multiple’ allows users to load multiple devices from the library in a single action.
- Transfer graphical properties and device attributes between objects using new graphic and format painter functionality.
- When creating detailed cable plans with E³.cable, wire seals can now be automatically added to all devices that are flagged as sealed in the device properties.
2D/3D cabinet layout and routing
Working in either two or three dimensions, E3.panel allows engineers to layout components inside panel enclosures. New feature highlights in E3.panel include:
- Mounting rails and cable ducts can now be placed and rotated to any angle, with docking points for automatic placement and routing rotated accordingly. This allows greater freedom in panel design with improved use of available space, especially in panel layout where form, fit and function are rapidly gaining importance.
- New sorting functionality for terminal strips offering enhanced cabinet layout. Several terminal strips can be selected for simultaneous sorting, with selection applied in the device tree or by area, in both the device tree and the terminal table. This offers time savings as all terminal strips can be sorted in one step rather than separately.
New integration for engineering data management
Design data management and library management capabilities have been enhanced through integrating DS-E3 functionality into the E³.series user interface. This allows the user to access certified library information, manage options and variants and initiate or respond to change requests within the E³.series environment. For the first time, electrical design data can be integrated with electronic data using the DS-2 platform.
AML format supported in E³.PLC Bridge
On a process level, integration into parallel and downstream activities and disciplines has been deepened. The choice of supported formats for data exchange with mechanical engineering and PLC programming toolsets has been extended to include the AML format for the exchange of PLC data. AML is used by leading PLC Manufacturers such as ABB, Siemens, Lenze, Phoenix Contact, Mitsubishi Electric and Murr Elektronik. The new AML import and export capabilities included in E³.PLC Bridge add to the existing interfaces of B&R and ABB.
New Module E³.NCBridge for Siemens CMC Topo
Siemens CreateMyConfig (CMC) Topo is used by OEMs to perform automated commissioning/production using modular machines. The new module, E³.NCBridge for Siemens CMC Topo allows unidirectional interface between E³.series schematics and the target system via XML.
New export formats in E³.3D Routing Bridge
Using the E3.3D Routing Bridge, schematic and connection information from E3.series can be interfaced to all major MCAD systems. Collaborating between E3.series and the chosen MCAD tool allows concurrent design. New export formats are:
- CATElectre, a new EWR module from Dassault
- KBL (STEP AP212/KBL 2.3)
- Definition in the INI file of the specific E³.3D Routing Bridge module
About Zuken
Zuken is a global provider of leading-edge software and consulting services for electrical and electronic design and manufacturing. Founded in 1976, Zuken has the longest track record of technological innovation and financial stability in the electronic design automation (EDA) software industry. The company’s extensive experience, technological expertise and agility, combine to create world-class software solutions. Zuken’s transparent working practices and integrity in all aspects of business produce long-lasting and successful customer partnerships that make Zuken a reliable long-term business partner.
For more information, click here.
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ASC Sunstone Circuits to Exhibit at PCB East 2026
04/26/2026 | ASC Sunstone CircuitsAnaya Vardya, President and CEO of ASC Sunstone Circuits, a leading provider of printed circuit board (PCB) fabrication and assembly solutions, announced that the company will be exhibiting at PCB East 2026, taking place April 29 at the DCU Convention Center.
PCB Technologies to Exhibit at PCB East 2026
04/23/2026 | PCB Technologies Ltd.Issey Ende, PCB-Technolgies’ VP of Sales and Marketinghas announced that his company will be exhibiting at this year’s PCB East 2026, the premier East Coast conference and exhibition for the electronics design, fabrication, and assembly industry on Wednesday, April 29, 2026, at the DCU Convention Center in Worcester, Massachusetts.
Design for Test: A New Book from The Test Connection, Inc.
04/23/2026 | Real Time with... APEX EXPOBert Horner, president of The Test Connection Inc., shares insights on designing for testability (DFT) challenges with Kelly Dack. Horner discusses the critical need for incorporating testability early in the design process and the importance of quantifiable metrics for measuring test coverage. He highlights The Test Connection's role in transferring decades of 'tribal knowledge' to emerging engineers through training and education. Look for "The Printed Circuit Assembler's Guide to... Design for Test, A Practical Guide to Test and Inspection" in the I-007eBooks library.
Changing Times: Siemens Plans to Sell Former Mentor Graphics Wilsonville Campus
04/22/2026 | Nolan Johnson, I-Connect007Siemens announced it will be selling its Wilsonville, Oregon, property, which has served as the campus for Mentor Graphics, which was later acquired by German EDA-giant Siemens, as reported by The Oregonian on April 20. Siemens will maintain one building on the sprawling 53-acre campus, citing the move to hybrid and remote work over the past few years as a key factor in the decision.
Siemens Collaborates with TSMC to Advance AI for Semiconductor Design
04/22/2026 | SiemensSiemens announced the continuation of collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement.