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Indium Expert to Present at IPC Electronics Assembly High Reliability Technical Conference
August 7, 2017 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation’s Joey Qiao, Area Technical Manager for Eastern China, will share his technical expertise at the IPC Electronics Assembly High Reliability Technical Conference on August 18 in Ningbo, China. The conference focuses on reliability for both automotive and communications electronics.
Qiao’s presentation, Low Temperature Solders: New Applications and Challenges, covers:
- Drivers for low-temperature soldering
- Forecast on solder melting temperatures for SMT assembly
- Low-temperature alloy applications, test results, and recommendations
Qiao is an Area Technical Manager for Eastern China. He joined Indium Corporation in 2015 and has more than 12 years of experience in the electronics industry. Qiao provides technical support for Indium Corporation’s electronics assembly materials, engineered solders, and thermal management materials for customers in Eastern China. Qiao holds a six sigma green belt and process failure mode effects analysis (PFMEA) certification. He is also an ISO-13485 internal auditor.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, click here.
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