-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
iNEMI's Bill Bader to Keynote Technical Innovations Symposium at SMTA International
August 8, 2017 | SMTAEstimated reading time: 1 minute
Bill Bader, CEO of iNEMI, will keynote the 2017 Technical Innovations Symposium at SMTA International 2017, which will be held from September 17–21, 2017 in Rosemont, Illinois. Bader's presentation is titled "2017 iNEMI Roadmap Highlights Impacting Board Assembly over the Next 5-10 Years".
The iNEMI roadmap has become recognized as an important tool for defining the "state of the art" in the electronics industry as well as identifying emerging and disruptive technologies. The keynote presentation will discuss the major trends that will impact board and component assembly in the near future, with insights to identify potentially disruptive innovations that could be the basis for radical changes to current programs and equipment.
Bill Bader joined iNEMI in August 2009 as Chief Executive Officer. He is a 26-year veteran of Intel Corporation, and he brings to iNEMI a wide range of experience, including factory management for high-volume production, new product development, hardware and software design and test, and assembly and test technology development. He also served as Intel’s representative on the iNEMI Technical Committee from 1998 to 2005.
The Technical Innovations Symposium at SMTA International will feature new research from companies and institutions such as Celestica Inc., Centre for Mechatronics and Automation, Fraunhofer Institute, Harris Corporation, i3 Electronics, National Physical Laboratory, Plexus Corp., and more. Session topics include Micro-Dispensing and Additive Manufacturing Developments, Adhesive and Coating Development and Characterization, Adhesive Development and Characterization, and Panel Processing Technologies for Packaging. A panel of industry experts will give short presentations and discuss current/future trends in Lead-Free and other advanced packaging technologies to wrap-up the symposium.
About SMTA - A Global Association Working at a Local Level
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Suggested Items
SMTA UHDI Symposium: Shortening the Learning Curve
01/15/2025 | Marcy LaRont, I-Connect007SMTA’s second annual UHDI Symposium on Jan. 23 in Phoenix will highlight groundbreaking discussions on UHDI assembly test board, innovative electronic inks, process controls, and signal integrity solutions. Organizer Tara Dunn talks about the importance of the event and how she prepared presentations and discussions that would appeal to fabricators, assemblers, and designers. This event will shorten your learning curve and spark new ideas that push the boundaries of hardware electronics manufacturing. There’s still time to register.
Happy’s Tech Talk #36: The LEGO Principle of Optical Assembly
01/14/2025 | Happy Holden -- Column: Happy’s Tech TalkDr. Steven Case of Avanti Optics Corporation once advocated a new approach to photonic assembly, based on the LEGO principle. He compared today’s erbium-doped fiber amplifier (EDFA) technology to the crude point-to-point wiring of early model circuit boards, which gave way to modern circuit boards that could be considered prefabricated interconnects.
SMTA Hosts Ultra High Density Interconnect Symposium
12/31/2024 | SMTAThe Surface Mount Technology Association (SMTA) is pleased to announce the Ultra High Density Interconnect (UHDI) Symposium, taking place on Thursday, January 23 2025, at the Peoria Sports Complex in Peoria, Arizona.
SP Manufacturing Expands with New Malaysia Plant, Acquires Ideal Jacobs
12/26/2024 | PRNewswireSP Manufacturing (SPM), a leader in Electronic Manufacturing Services (EMS), is strengthening its global presence with two major moves: opening a new manufacturing facility in Senai, Malaysia, and successfully acquiring Ideal Jacobs Corporation.
Flex Factory Recognized for Manufacturing Excellence and Continuous Improvement by the Association for Manufacturing Excellence
12/19/2024 | FlexFlex announced that its Zhuhai, China site, specializing in advanced assembly, tool design and manufacturing, and metal and plastics capabilities for Lifestyle and Data Center customers, received an Excellence Award from the Association for Manufacturing Excellence (AME) for demonstrating world-class continuous improvement and results. This is the third consecutive year a Flex facility received an AME Excellence Award.