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TE Connectivity Enables Faster PCB Assembly
August 8, 2017 | TE ConnectivityEstimated reading time: 1 minute
TE Connectivity (TE) a two-piece pluggable connector solution designed with surface mount technology (SMT). The family includes surface mount headers and mating plugs in vertical and right-angle configurations between two and twelve positions giving manufacturers design flexibility.
Target applications for TE’s new BUCHANAN WireMate connector Surface Mount TB series include HVAC equipment and controls, industrial controls, security systems, industrial lighting solutions, and elevators and escalators. These connectors are designed for manufacturers looking to make the change to full SMT printed circuit boards (PCBs) or requiring a product capable of withstanding reflow soldering temperatures. TE’s BUCHANAN WireMate connector Surface Mount TB series allows for faster PCB assembly, and optional SMT retention features further ensure secure PCB mounting. The connectors have tin-plated copper alloy contacts, and the housing material has a UL 94 V-0 flammability rating.
BUCHANAN WireMate connector Surface Mount TB series are available with 3.5 mm and 5.0 mm centerlines. The 3.5mm centerline offering accepts 30 - 16AWG and is rated for 8A at 300V. The 5.0mm centerline accepts 26 -12 AWG wire gauge and is rated 15A (2-9 positions) at 300 V or 10A (10-12 positions) at 300V.
For more information on TE’s BUCHANAN WireMate connector Surface Mount TB series, click here.
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The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
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